Cellphone ICs

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
CC1260RGZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm		7 mm				e4	30	260	7 mm
TRF6900PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.2/3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7 mm
TRF4900PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TCM320AC56IDWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm
AFE7921IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm		17 mm			RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
CC2511F16RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
CC2400-STB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm		7 mm	Not Qualified						7 mm
TRF6900APTR	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.05 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
LMH2100TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		9.2 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.675 mm		.844 mm				e1	30	260	1.244 mm
TRF4400PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
LMV228TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified						1.014 mm
CC2420-RTR2	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		.9 mm		7 mm	Not Qualified						7 mm
TCM320AC56N	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL	R-PDIP-T20		5.08 mm		7.62 mm	Not Qualified						24.325 mm
TCM8030	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified						12 mm
TCM4400EPETR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK			.4 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.2 mm		10 mm	Not Qualified						10 mm
TLV321AC36IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS		3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL	R-PDIP-T20		5.08 mm		7.62 mm	Not Qualified						24.325 mm
TLV320AC56IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0075 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	-40 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
LMV225TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified						1.014 mm
TLV320AC57DW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm
TCM320AC57CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	70 Cel	0 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
TRF4900	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	60 Cel	-20 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified						7.8 mm
CC2420RGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N48	3	1 mm		7 mm	Not Qualified			e4	30	260	7 mm
AFE7988IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm		17 mm			RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
TCM4400EGGM	Texas Instruments	BASEBAND CIRCUIT	OTHER	BALL	80	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	.03 mA	3 V	3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA80,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-25 Cel			BOTTOM	S-PBGA-B80		1.4 mm		10 mm	Not Qualified						10 mm
TLV320AC57N	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL	R-PDIP-T20		5.08 mm		7.62 mm	Not Qualified						24.325 mm
GC5322IZND	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B352	3	1.6 mm		27 mm	Not Qualified			e1	30	260	27 mm
TRF5901PT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.053 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
LMH9226IRRLR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		100 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC12,.08SQ,20		.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N12	2	.8 mm		2 mm				e4	30	260	2 mm
TLV320AC57IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0075 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	-40 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
HPA00471RSSR	Texas Instruments	RF AND BASEBAND CIRCUIT																					NICKEL PALLADIUM GOLD			3							e4	30	260
TCM320AC56IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
CC2511F8RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
TCM320AC56DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm
TCM4300PZ-00	Texas Instruments	RF AND BASEBAND CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, LOW PROFILE, FINE PITCH			.5 mm					QUAD	S-PQFP-G100		1.6 mm		14 mm	Not Qualified						14 mm
LMV228URX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm		.975 mm	Not Qualified			e0	40	260	.975 mm
LP3939ILQ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-PQCC-N16		.8 mm		4 mm							4 mm
TRF5901PTRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.053 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TCM320AC57IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	-40 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
TRF4903PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.042 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TCM8000FR	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		5 V		FLATPACK			.8 mm	80 Cel	-25 Cel			QUAD	S-PQFP-G44		2.25 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TRF6900APTRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.05 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	70 Cel	-20 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
LMV226TL/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1							e1	30	260
TLV320AC56CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.0075 mA	3 V	3	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
LMV227SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm		2.2 mm	Not Qualified			e0			2.5 mm
LMV225UR/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL		VFBGA	SQUARE	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH							TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1							e1	30	260
CC2510F8RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm
CC2511F8RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
LMV225SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm		2.2 mm	Not Qualified			e0		260	2.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.