Digital Transmission Support

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ZL30136GGG2	Microchip Technology	ELASTIC BUFFER	INDUSTRIAL	BALL	64	BGA	SQUARE	PLASTIC/EPOXY	YES	1		153 mA	1.8 V	1.8,3.3	GRID ARRAY	BGA64,8X8,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B64		1.72 mm			9 mm	Not Qualified	ALSO REQUIRED 3.3V SUPPLY	e1			9 mm
MT9041BP1	Microchip Technology	ELASTIC BUFFER																			MATTE TIN				3							e3
DS2176QN/T&R	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.01 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	2.048 Mbps	S-PQCC-J28	1	4.57 mm	T-1(DS1)	CEPT PCM-30/E-1	11.505 mm	Not Qualified		e0			11.505 mm
DS2175SN+T&R	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e3			10.3 mm
DS2176Q/T&R	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.01 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	2.048 Mbps	S-PQCC-J28	1	4.57 mm	T-1(DS1)	CEPT PCM-30/E-1	11.505 mm	Not Qualified		e0			11.505 mm
DS2175SN/T&R	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e0			10.3 mm
DS2175SN	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e0			10.3 mm
DS2176QN	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.01 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	2.048 Mbps	S-PQCC-J28	1	4.57 mm	T-1(DS1)	CEPT PCM-30/E-1	11.505 mm	Not Qualified		e0			11.505 mm
DS2175S/T&R	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e0			10.3 mm
DS2175+	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.016 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDIP-T16	1	4.572 mm			7.62 mm	Not Qualified		e3	30	260	19.175 mm
DS2176	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.01 mA	5 V	5	IN-LINE	DIP24,.3	Digital Transmission Interfaces	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	2.048 Mbps	R-PDIP-T24	1	4.572 mm	T-1(DS1)	CEPT PCM-30/E-1	7.62 mm	Not Qualified		e0		245	30.545 mm
DS2175SN+	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e3	30	260	10.3 mm
DS2176Q+	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-J28	1	4.57 mm			11.5062 mm	Not Qualified		e3		245	11.5062 mm
DS2175S+	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e3	30	260	10.3 mm
DS2176N	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.01 mA	5 V	5	IN-LINE	DIP24,.3	Digital Transmission Interfaces	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	2.048 Mbps	R-PDIP-T24	1	4.572 mm	T-1(DS1)	CEPT PCM-30/E-1	7.62 mm	Not Qualified		e0		245	30.545 mm
DS2175S+T&R	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e3	30	260	10.3 mm
DS2176+	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.01 mA	5 V	5	IN-LINE	DIP24,.3	Digital Transmission Interfaces	2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL	2.048 Mbps	R-PDIP-T24	1	4.572 mm	T-1(DS1)	CEPT PCM-30/E-1	7.62 mm	Not Qualified		e3	30	260	30.545 mm
DS2175	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.016 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDIP-T16	1	4.572 mm			7.62 mm	Not Qualified		e0			19.175 mm
DS2176Q	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.01 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Digital Transmission Interfaces	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	2.048 Mbps	S-PQCC-J28	1	4.57 mm	T-1(DS1)	CEPT PCM-30/E-1	11.505 mm	Not Qualified		e0			11.505 mm
DS2175S	Maxim Integrated	ELASTIC BUFFER	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.016 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	2.65 mm			7.5 mm	Not Qualified		e0			10.3 mm
DS2175N	Maxim Integrated	ELASTIC BUFFER	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.016 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDIP-T16	1	4.572 mm			7.62 mm	Not Qualified		e0			19.175 mm

Digital Transmission Support refers to the various tools and technologies used to ensure the efficient and reliable transmission of digital signals over communication networks. These tools and technologies are designed to address issues such as signal interference, transmission errors, and network congestion, which can degrade the quality and speed of digital transmission.

One important aspect of Digital Transmission Support is the use of error detection and correction techniques. These techniques involve adding redundancy to the transmitted data, allowing the receiver to detect and correct any errors that may occur during transmission. Error detection and correction techniques are commonly used in communication protocols such as TCP/IP and Ethernet, and can help to ensure reliable data transmission even in the presence of noise or other transmission errors.

Another important aspect of Digital Transmission Support is the use of network congestion control techniques. These techniques are designed to prevent network congestion, which can occur when too many data packets are transmitted simultaneously, leading to delays and dropped packets. Network congestion control techniques include methods such as packet queuing, traffic shaping, and flow control, which help to regulate the flow of data over the network and prevent congestion.

Digital Transmission Support also includes technologies such as encryption and compression, which are used to protect data privacy and reduce transmission bandwidth. Encryption involves encoding data in such a way that it can only be decoded by authorized parties, while compression involves reducing the size of data by removing redundant or unnecessary information.