Part | RoHS | Manufacturer | Mounting Feature | Maximum Contact AC Rating (R Load) | Electrical Life | Maximum Contact DC Power Rating (R Load) | Insulation Resistance | Packing Method | Body Length/Diameter | Body Width | Sealing | End Contact Plating | Body Height | Maximum Contact DC Rating (R Load) | Maximum Operating Temperature | Maximum AC Contact Current | Minimum Operating Temperature | Terminal Finish | Maximum DC Contact Current | Termination Type | Manufacturer Series | Contact Resistance | End Contact Material | PCB Hole Count | Maximum DC Contact Voltage | Additional Features | Maximum AC Contact Voltage | JESD-609 Code | Terminal Length | Maximum Contact AC Power Rating (R Load) |
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TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
6.2 mm |
6.2 inch |
TAPE SEALED |
GOLD OVER NICKEL |
2.31 mm |
.025A@24VDC |
85 Cel |
.1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
50 V |
||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
13.82 mm |
6.2 inch |
TAPE SEALED |
GOLD OVER NICKEL |
2.31 mm |
.025A@24VDC |
85 Cel |
.1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
50 V |
ROHS COMPLIANT |
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TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
BOX; TUBE |
12.14 mm |
8.15 inch |
GOLD OVER NICKEL |
6 mm |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
COPPER ALLOY |
5 V |
.157 inch |
|||||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
8.74 mm |
6.2 inch |
TAPE SEALED |
GOLD OVER NICKEL |
2.21 mm |
.025A@24VDC |
85 Cel |
.1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
50 V |
LOW PROFILE |
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TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
11.28 mm |
6.2 inch |
TAPE SEALED |
GOLD OVER NICKEL |
2.31 mm |
.025A@24VDC |
85 Cel |
.1 A |
-30 Cel |
Gold (Au) - with Nickel (Ni) barrier |
.1 A |
SOLDER |
110 mohm |
COPPER ALLOY |
50 V |
ROHS COMPLIANT |
e4 |
|||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
3.66 mm |
3.66 inch |
TAPE SEALED |
GOLD OVER NICKEL |
2.31 mm |
.025A@24VDC |
85 Cel |
.1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
50 V |
||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
7.06 mm |
7.06 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
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ITT Cannon |
SURFACE MOUNT-STRAIGHT |
1000 Cycle(s) |
TAPE AND REEL |
16 mm |
6.2 inch |
TAPE SEALED |
2.3 mm |
.025A@24VDC |
85 Cel |
-20 Cel |
Gold Flash (Au) - with Nickel (Ni) barrier |
.025 A |
SOLDER |
TDA |
24 V |
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TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
6.2 mm |
6.2 inch |
TAPE SEALED |
GOLD OVER NICKEL |
2.31 mm |
.025A@24VDC |
85 Cel |
.1 A |
-30 Cel |
Gold (Au) - with Nickel (Ni) barrier |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
50 V |
ROHS COMPLIANT |
e4 |
|||||||||
TE Connectivity |
THROUGH HOLE-STRAIGHT |
12.19 mm |
9.65 inch |
7.37 mm |
SOLDER |
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TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
BOX |
12.19 mm |
9.65 inch |
TIN |
8.64 mm |
70 Cel |
1 A |
-25 Cel |
1 A |
WIRE |
COPPER ALLOY |
40 V |
.14 inch |
||||||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
1000000000 ohm |
TUBE |
12.14 mm |
7.5 inch |
GOLD OVER NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
||||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
BOX; TUBE |
22.3 mm |
8.15 inch |
GOLD OVER NICKEL |
6 mm |
85 Cel |
1 A |
-30 Cel |
Gold (Au) - with Nickel (Ni) barrier |
1 A |
WIRE |
COPPER ALLOY |
5 V |
e4 |
.157 inch |
|||||||||||||
Nidec Copal Electronics |
SURFACE MOUNT-STRAIGHT |
2000 Cycle(s) |
1000000000 ohm |
TR, EMBOSSED, 10 INCH |
5.6 mm |
2.5 inch |
WATERPROOF |
GOLD |
2.5 mm |
0.1A@6VDC |
85 Cel |
-40 Cel |
Gold (Au) |
.1 A |
SOLDER |
50 mohm |
COPPER ALLOY |
6 V |
LOW PROFILE |
e4 |
||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
22.3 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
27.36 mm |
7.5 inch |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
||||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
1000000000 ohm |
TUBE |
12.14 mm |
7.49 inch |
EPOXY |
GOLD OVER NICKEL |
3.5 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
300 mohm |
COPPER ALLOY |
8 |
5 V |
ROHS AND ELV COMPLIANT |
.157 inch |
0.4VA@20VAC |
||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
12.14 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
TUBE |
22.3 mm |
7.49 inch |
TAPE SEALED |
GOLD OVER NICKEL |
4 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
COPPER ALLOY |
5 V |
.157 inch |
|||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
1000000000 ohm |
TUBE |
7.06 mm |
7.5 inch |
GOLD OVER NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
BOX; TUBE |
12.14 mm |
7.5 inch |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
||||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
TUBE |
14.7 mm |
7.49 inch |
GOLD OVER NICKEL |
3.5 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
COPPER ALLOY |
5 V |
.157 inch |
||||||||||||||
TE Connectivity |
PANEL MOUNT |
10000 Cycle(s) |
TRAY |
10.2 mm |
4.3 inch |
EPOXY TERMINAL SEALED |
4.5 mm |
.1A@12VDC |
70 Cel |
.1 A |
-20 Cel |
.1 A |
SOLDER |
COPPER ALLOY |
12 V |
LOW PROFILE |
||||||||||||||
TE Connectivity |
PANEL MOUNT |
TR |
8.75 mm |
TAPE SEALED |
GOLD OVER NICKEL |
2.2 mm |
85 Cel |
.1 A |
-30 Cel |
.1 A |
SOLDER |
COPPER ALLOY |
50 V |
|||||||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
7.06 mm |
7.06 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
1000000000 ohm |
TUBE |
22.3 mm |
7.49 inch |
GOLD OVER NICKEL |
3.5 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
300 mohm |
COPPER ALLOY |
8 |
5 V |
ROHS COMPLIANT |
.157 inch |
||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
17.22 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
Gold (Au) - with Nickel (Ni) barrier |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
e4 |
|||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
27.36 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
Nidec Copal Electronics |
SURFACE MOUNT-STRAIGHT |
2000 Cycle(s) |
1000000000 ohm |
TR, EMBOSSED, 10 INCH |
5.4 mm |
2.5 inch |
WATERPROOF |
GOLD |
2.5 mm |
0.1A@6VDC |
85 Cel |
-40 Cel |
Gold (Au) |
.1 A |
SOLDER |
50 mohm |
COPPER ALLOY |
6 V |
LOW PROFILE |
e4 |
||||||||||
Nidec Copal Electronics |
SURFACE MOUNT-STRAIGHT |
2000 Cycle(s) |
1000000000 ohm |
TR, EMBOSSED, 10 INCH |
6.6 mm |
5.6 inch |
GOLD |
2.5 mm |
0.1A@6VDC |
85 Cel |
-40 Cel |
Gold (Au) |
.1 A |
SOLDER |
50 mohm |
COPPER ALLOY |
6 V |
LOW PROFILE |
e4 |
|||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
BOX |
22.35 mm |
9.65 inch |
TIN |
8.64 mm |
70 Cel |
1 A |
-25 Cel |
1 A |
WIRE |
COPPER ALLOY |
40 V |
.14 inch |
||||||||||||||||
TE Connectivity |
THROUGH HOLE-STRAIGHT |
22.35 mm |
9.65 inch |
7.37 mm |
SOLDER |
5435640 |
||||||||||||||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
27.36 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
Nidec Copal Electronics |
SURFACE MOUNT-STRAIGHT |
2000 Cycle(s) |
1000000000 ohm |
TR, EMBOSSED, 10 INCH |
6.6 mm |
5.6 inch |
WATERPROOF |
GOLD |
2.5 mm |
0.1A@6VDC |
85 Cel |
-40 Cel |
Gold (Au) |
.1 A |
SOLDER |
50 mohm |
COPPER ALLOY |
6 V |
LOW PROFILE |
e4 |
||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
1000000000 ohm |
TUBE |
17.22 mm |
7.49 inch |
GOLD OVER NICKEL |
3.5 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
Gold (Au) - with Nickel (Ni) barrier |
1 A |
WIRE |
300 mohm |
COPPER ALLOY |
6 |
5 V |
UL |
e4 |
.157 inch |
||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
TUBE |
27.4 mm |
7.49 inch |
GOLD OVER NICKEL |
3.5 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
COPPER ALLOY |
5 V |
.157 inch |
||||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
22.3 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
Nidec Copal Electronics |
SURFACE MOUNT-STRAIGHT |
2000 Cycle(s) |
1000000000 ohm |
TR, EMBOSSED, 10 INCH |
5.6 mm |
2.5 inch |
GOLD |
2.5 mm |
0.1A@6VDC |
85 Cel |
-40 Cel |
Gold (Au) |
.1 A |
SOLDER |
50 mohm |
COPPER ALLOY |
6 V |
LOW PROFILE |
e4 |
|||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
17.22 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
Nidec Copal Electronics |
SURFACE MOUNT-STRAIGHT |
2000 Cycle(s) |
1000000000 ohm |
TR, EMBOSSED, 10 INCH |
5.4 mm |
2.5 inch |
GOLD |
2.5 mm |
0.1A@6VDC |
85 Cel |
-40 Cel |
Gold (Au) |
.1 A |
SOLDER |
50 mohm |
COPPER ALLOY |
6 V |
LOW PROFILE |
e4 |
|||||||||||
Nidec Copal Electronics |
SURFACE MOUNT-STRAIGHT |
2000 Cycle(s) |
1000000000 ohm |
TR, EMBOSSED, 10 INCH |
5.6 mm |
2.5 inch |
GOLD |
2.5 mm |
0.1A@6VDC |
85 Cel |
-40 Cel |
Gold (Au) |
.1 A |
SOLDER |
50 mohm |
COPPER ALLOY |
6 V |
LOW PROFILE |
e4 |
|||||||||||
ITT Cannon |
SURFACE MOUNT-STRAIGHT |
1000 Cycle(s) |
TAPE AND REEL |
16 mm |
6.2 inch |
TAPE SEALED |
2.3 mm |
.025A@24VDC |
85 Cel |
-20 Cel |
Gold Flash (Au) - with Nickel (Ni) barrier |
.025 A |
SOLDER |
TDA |
24 V |
|||||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
BOX; TUBE |
12.14 mm |
8.15 inch |
GOLD OVER NICKEL |
6 mm |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
COPPER ALLOY |
5 V |
.157 inch |
|||||||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
TUBE |
7.06 mm |
7.49 inch |
GOLD OVER NICKEL |
3.5 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
COPPER ALLOY |
5 V |
.157 inch |
||||||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
1000 Cycle(s) |
1000000000 ohm |
TUBE |
24.84 mm |
7.49 inch |
GOLD OVER NICKEL |
3.5 mm |
.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
300 mohm |
COPPER ALLOY |
18 |
5 V |
.157 inch |
|||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TR |
12.14 mm |
7.5 inch |
TAPE SEALED |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
|||||||||||
TE Connectivity |
THROUGH HOLE-RIGHT ANGLE |
TUBE |
22.25 mm |
GOLD OVER NICKEL |
3.5 mm |
85 Cel |
1 A |
-30 Cel |
1 A |
WIRE |
COPPER ALLOY |
5 V |
.157 inch |
|||||||||||||||||
TE Connectivity |
PANEL MOUNT |
1000 Cycle(s) |
100000000 ohm |
TUBE |
7.06 mm |
7.06 inch |
NICKEL |
3.5 mm |
0.1A@24VDC |
85 Cel |
1 A |
-30 Cel |
.1 A |
SOLDER |
100 mohm |
COPPER ALLOY |
24 V |
APPROVAL: UL |
DIP and SIP switches are small, manually operated switches used in electronic devices for the purpose of selecting various options or settings. The acronym DIP stands for Dual In-line Package, while SIP stands for Single In-line Package. Both types of switches consist of a series of tiny switch contacts arranged in a row that can be set to either an open or closed position.
DIP switches are typically used in older electronic equipment, such as computers and other devices that use integrated circuits. They are usually mounted on a small printed circuit board and can be set to a particular configuration by manually moving the tiny levers into the open or closed position.
SIP switches, on the other hand, are commonly used in a wide range of electronic devices, such as telecommunications equipment, consumer electronics, and industrial automation. They are generally smaller than DIP switches and are often used in situations where space is at a premium. Like DIP switches, SIP switches are manually operated and can be set to an open or closed position to select a particular option or setting.