Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX5864ETM+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MC13142D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm					9.9 mm
SKY66423-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.8 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
ADL5387ACPZ-WP	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3		260	4 mm
MAX2902ETI+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e3	30	260	5 mm
SKY66291-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	16					1			5 V									UNSPECIFIED	S-XXSS-X16	3						260
ADL5387ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3		260	4 mm
LT5521EUF#PBF	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
SKY65366-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28		SQUARE	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	S-XQMA-N28		1.15 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY65933-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16		SQUARE	UNSPECIFIED	YES	1			1.8 V		MICROELECTRONIC ASSEMBLY			.475 mm	85 Cel	-40 Cel		QUAD	S-XQMA-N16		.8 mm	2.5 mm			NOT SPECIFIED	NOT SPECIFIED	2.5 mm
SKY66121-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1		600 mA	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16	3	.81 mm	4 mm				260	4 mm
SKY66122-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36	3	1 mm	6 mm					6 mm
SKY68031-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT					SQUARE			1														3
RFX1010	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD	S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
RFX2402E	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD	S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY53735-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	47	HVQCCN	RECTANGULAR		YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC47,.16X.24,16		.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N47	3	.7 mm	4.2 mm				260	6.2 mm
SKY65344-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	BCC	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER			1 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20		1.4 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY77365-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
RFX2411	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	125 Cel	-40 Cel		QUAD	S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY65313-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28		SQUARE	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	S-XQMA-N28	3	1 mm	6 mm					6 mm
SKY66105-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	12	HVQCCN	RECTANGULAR		YES	1			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				85 Cel	-40 Cel		QUAD	R-XQCC-N12		1.15 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
SKY66119-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	28	QCCN	SQUARE		YES	1		20 mA	3.3 V		CHIP CARRIER				85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-XQCC-N28	3	1.15 mm	6 mm		e4		260	6 mm
SKY66293-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT																						3						260
SKY85747-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVFLGA	RECTANGULAR		YES	1		500 mA	5 V		GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel		BOTTOM	R-XBGA-N24		1 mm	3 mm					5 mm
IAM-91563-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
ISL5216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
RFX5000B	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SE5007BT-R	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY13491-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		SQUARE	UNSPECIFIED	YES	1			2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-30 Cel		QUAD	S-XQMA-N22	3	.9 mm	2.5 mm				260	2.9 mm
SKY13529-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	17		RECTANGULAR	UNSPECIFIED	YES	1			2.85 V		MICROELECTRONIC ASSEMBLY				90 Cel	-35 Cel		QUAD	R-XQMA-N17		.84 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY53735-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	47	HVQCCN	RECTANGULAR		YES	1			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC47,.16X.24,16		.4 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N47	3	.7 mm	4.2 mm				260	6.2 mm
SKY58081-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	56	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		3200 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.23X.3,17		.44 mm	110 Cel	-40 Cel		QUAD	R-PQCC-N56		.7 mm	6 mm					7.6 mm
SKY65174-21	Skyworks Solutions	RF FRONT END CIRCUIT	OTHER	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-35 Cel		DUAL	S-XDMA-N10		.95 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY66115-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE		YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32		.8 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-XQCC-N16	3	1 mm	4 mm		e4		260	4 mm
SKY73083-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36	3	1.15 mm	6 mm	Not Qualified			260	6 mm
SKY73208-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36		SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel		QUAD	S-XQMA-N36	3	1.45 mm	6 mm				260	6 mm
SKY73420-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-XQCC-N36		.9 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
SKY77762-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1			3.4 V		MICROELECTRONIC ASSEMBLY				75 Cel	-30 Cel		DUAL	S-XDMA-N10		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY85402-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20	3	.9 mm	4 mm				260	4 mm
WFM200S022XNA2	Silicon Labs																							3					40	260
WFM200S022XNN2	Silicon Labs																							3					40	260
1605C	Murata Manufacturing	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	UNSPECIFIED	NO	1					IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL	R-XDIP-T16		6.84 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	22.5 mm
AD6688BBPZ-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.975 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
AD8348ARUZ-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
ADF7020BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3		260	7 mm
ADF7021-VBCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADRF6701ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES		BICMOS		5 V	5	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AT86RF231-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32		1 mm	5 mm	Not Qualified	e3			5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.