Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
HMC422MS8ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm		3 mm					e3		260	3 mm
HMC689LP4ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	1 mm		4 mm					e3	30	260	4 mm
TCM320AC57PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified							7 mm
LMH6523SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	4		485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	25.74 dB	MATTE TIN	QUAD	R-XQCC-N54	2	.8 mm		5.5 mm					e3	30	260	10 mm
LMV225TLX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified							1.014 mm
CC2400RSU	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		1 mm		7 mm	Not Qualified							7 mm
LMH2121TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B4		.675 mm		.866 mm								1.07 mm
TCM8002IFR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V		FLATPACK			.8 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G44		2.25 mm		10 mm								10 mm
CC2420	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48				7 mm	Not Qualified							7 mm
CC2510F8RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified				e4	30	260	6 mm
TCM320AC56CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW				NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
CC2511F16RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	.9 mm		6 mm	Not Qualified				e4	30	260	6 mm
LMH2121TMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4.7 mA	2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B4	1	.675 mm		.858 mm					e1	30	260	1.058 mm
TCM4300PZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G100		1.6 mm		14 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	14 mm
CC2510F32RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified				e4	NOT SPECIFIED	260	6 mm
TCM320AC57CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW				NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
ADS58C20IPFP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	3	1.2 mm		12 mm				3.45 V	e4	30	260	12 mm
LMH6522SQ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	R-XQCC-N54		.8 mm		5.5 mm						NOT SPECIFIED	NOT SPECIFIED	10 mm
TLV320AC56IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW				NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC57CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0075 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	70 Cel	0 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	A-LAW				NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
TRF6903PTRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified				e4	30	260	7 mm
TRF1015DBLE	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.75 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2 mm		5.3 mm	Not Qualified							7.2 mm
TCM8002FR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V	3.3/5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G44		2.25 mm		10 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	10 mm
TRF6901PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			.04 mA	2.7 V	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified				e4	30	260	7 mm
LMV227SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN	DUAL	R-XDSO-N6	1	.8 mm		2.2 mm	Not Qualified				e3			2.5 mm
TCM4400APN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified							12 mm
TLV321AC37CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified							7 mm
LMH2120UMX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		4 mA	4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.47 mm		.816 mm					e1	30	260	1.216 mm
CC2510F32RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified				e4	30	260	6 mm
TLV321AC36CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified							12.8 mm
TCM4400PNR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified							12 mm
ADS58C23IPFP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	3	1.2 mm		12 mm				3.45 V	e4	30	260	12 mm
CC2420Z-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		.9 mm		7 mm	Not Qualified							7 mm
TCM4400PN	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3/5,3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	12 mm
CC2511F16RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified				e4	NOT SPECIFIED	260	6 mm
AFE7700IALK	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B400	3	2.65 mm		17 mm			RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000		e0	20	220	17 mm
LMH2120UMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B6		.47 mm		.825 mm	Not Qualified							1.225 mm
TLV320AC57DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified							12.8 mm
HPA02142RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4 mA	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	2	1 mm		4 mm					e4	30	260	4 mm
LMH6521SQX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N32		.8 mm		5 mm								5 mm
TLV321AC36IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified							7 mm
TCM4400EPNR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK			.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified							12 mm
TCM320AC56PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified							7 mm
LMV225SDX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN	DUAL	R-XDSO-N6	1	.8 mm		2.2 mm	Not Qualified				e3			2.5 mm
TCM320AC57IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW				NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TCM4300PZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G100		1.6 mm		14 mm	Not Qualified							14 mm
TLV321AC37CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified							12.8 mm
CC2510F8RHHR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified				e4	NOT SPECIFIED	260	6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.