Cellphone ICs
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Width | Qualification | Companding Law | Input Type | Additional Features | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
80 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
.05 mA |
3.3 V |
3.3 |
FLATPACK, FINE PITCH |
QFP80,.55SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G80 |
1.8 mm |
12 mm |
Not Qualified |
12 mm |
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|
Samsung |
BASEBAND CIRCUIT |
OTHER |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||
|
Samsung |
BASEBAND CIRCUIT |
OTHER |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||
|
Samsung |
RF AND BASEBAND CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
80 Cel |
-30 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
6.5 mm |
||||||||||||||||||||||||||
|
Samsung |
BASEBAND CIRCUIT |
OTHER |
BUTT |
32 |
VBCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-XBCC-B32 |
.8 mm |
5 mm |
Not Qualified |
5 mm |
|||||||||||||||||||||||
|
Samsung |
RF AND BASEBAND CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
24 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
80 Cel |
-30 Cel |
QUAD |
R-PQCC-N24 |
1 mm |
3.5 mm |
Not Qualified |
4.5 mm |
||||||||||||||||||||||||||
|
Samsung |
RF AND BASEBAND CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
80 Cel |
-30 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
6.5 mm |
Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.
Some common types of cellphone ICs include:
1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.
2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.
3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.
5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.