Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
CC2420-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N48	3	.9 mm		7 mm	Not Qualified			e4	30	260	7 mm
LMV232TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B8	1	.675 mm		1.5095 mm				e1	30	260	1.5095 mm
TCM320AC56IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
TCM320AC56IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0099 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	-40 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
TCM8000AFN	Texas Instruments	BASEBAND CIRCUIT
ADC31RF80IRMP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1439 mA	1.15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N72	3	.9 mm		10 mm				e4	30	260	10 mm
TCM320AC57IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
LMV228UR/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT																					TIN SILVER COPPER			1							e1	30	260
AFE7920IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm		17 mm			RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
1166	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N20		.95 mm		4 mm	Not Qualified						4 mm
TLV320AC56N	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL	R-PDIP-T20		5.08 mm		7.62 mm	Not Qualified						24.325 mm
TRF4900PW	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	70 Cel	0 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
LMV226UR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM	S-PBGA-B4	1	.425 mm		.975 mm	Not Qualified			e0	40	260	.975 mm
CC2511F8RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
CC2420ZRTC	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N48		.9 mm		7 mm	Not Qualified						7 mm
TCM320AC57CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0099 mA	5 V	5	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
GC5016-PBZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	252	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B252	3	2.02 mm		17 mm	Not Qualified			e1	30	260	17 mm
CC2420RTCR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N48	3	.9 mm		7 mm	Not Qualified			e4	30	260	7 mm
CC1260RGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N48	3	1 mm		7 mm				e4	30	260	7 mm
AFE7799IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B400	3	2.65 mm		17 mm			RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
TRF6903PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TLV320AC57IN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	85 Cel	-40 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
LMV228SD	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-XDSO-N6	1	.8 mm		2.2 mm	Not Qualified			e0			2.5 mm
CC2510F16RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm
LMH6521SQ/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	2		245 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	26 dB	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm		5 mm				e3	30	260	5 mm
CC2510F16RSP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
TLV320AC56DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm
GC5316IZED	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	388	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.5 V	1.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA388,26X26,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B388	3	2.5 mm		27 mm	Not Qualified			e1	30	260	27 mm
TLV320AC57CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
TLV320AC56CN	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS	.0075 mA	3 V	3	IN-LINE	DIP20,.3	Codecs	2.54 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDIP-T20		5.08 mm	13-BIT	7.62 mm	Not Qualified	MU-LAW			NOT SPECIFIED	NOT SPECIFIED	24.325 mm	YES
CC2510F16RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	30	260	6 mm
TRF4903PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
CC2510F16RHH	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm		6 mm	Not Qualified			e4	30	260	6 mm
HPA00420RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N16	2	1 mm		4 mm				e4	30	260	4 mm
TRF4000PWP	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-30 Cel			DUAL	R-PDSO-G14		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	5 mm
LMV226TLX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL		VFBGA	RECTANGULAR	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-XBGA-B4	1							e1	30	260
LMV226TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified			e1			1.014 mm
TLV321AC36IDW	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm
LMV228TL	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B4	1	.675 mm		1.014 mm	Not Qualified						1.014 mm
LMH6523SQ	Texas Instruments	RF AND BASEBAND CIRCUIT
CC2511F16RSPR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3.3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-XQCC-N36	3	.9 mm		6 mm	Not Qualified			e4	NOT SPECIFIED	260	6 mm
LMH2110TMX	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel			BOTTOM	R-PBGA-B6		.675 mm		.84 mm	Not Qualified						1.24 mm
LMH6522SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	4		485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC54,.2X.39,20		.5 mm	85 Cel	-40 Cel	25.74 dB	MATTE TIN	QUAD	R-XQCC-N54	2	.8 mm		5.5 mm				e3	30	260	10 mm
LMV225URX/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL		VFBGA	SQUARE	UNSPECIFIED	YES	1	1		8 mA			GRID ARRAY, VERY THIN PROFILE, FINE PITCH							TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1							e1	30	260
TRF6900	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-20 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
TRF6901PTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TLV321AC36CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
LMV228SD/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD		HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		8 mA			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE							MATTE TIN	DUAL	R-PDSO-N6	1							e3	30	260

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.