Texas Instruments - TCM4400EGGM

TCM4400EGGM by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TCM4400EGGM
Description BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 80; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet TCM4400EGGM Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Maximum Seated Height: 1.4 mm
Sub-Category: Other Telecom ICs
Surface Mount: YES
Maximum Supply Current: .03 mA
No. of Terminals: 80
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: BICMOS
JESD-30 Code: S-PBGA-B80
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 10 mm
Telecom IC Type: BASEBAND CIRCUIT
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA80,10X10,32
Length: 10 mm
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 3
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