Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Minimum Isolation | Maximum Insertion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
12 |
31.76 dBm |
1.2 |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
17 dB |
1.5 dB |
ISOLATION-MIN (DB):17 |
1600 MHz |
3300 MHz |
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|
Mini-circuits |
COMBINER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
31.76 dBm |
1.5 |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tin/Silver/Nickel (Sn/Ag/Ni) |
16 dB |
1.8 dB |
ISOLATION-MIN (DB):16 |
e2 |
3400 MHz |
4600 MHz |
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|
Mini-circuits |
COMBINER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
31.76 dBm |
1.4 |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tin/Silver/Nickel (Sn/Ag/Ni) |
19 dB |
1.4 dB |
ISOLATION-MIN (DB):19 |
e2 |
1710 MHz |
2025 MHz |
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Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
6 |
33.01 dBm |
1.26 |
COMPONENT |
FL6,.2,100 |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
20 dB |
1 dB |
e0 |
1 MHz |
650 MHz |
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|
Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
33.01 dBm |
COMPONENT |
50 ohm |
Tin (Sn) - with Nickel (Ni) barrier |
20 dB |
1 dB |
e3 |
1 MHz |
650 MHz |
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Cobham Plc |
SPLITTER AND COMBINER |
33.01 dBm |
1.35 |
COAXIAL |
50 ohm |
125 Cel |
-55 Cel |
GOLD |
TNC-F |
e4 |
0 MHz |
2000 MHz |
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|
Mini-circuits |
COMBINER |
SURFACE MOUNT |
12 |
31.76 dBm |
1.4 |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tin/Silver (Sn/Ag) - with Nickel (Ni) barrier |
12 dB |
1.9 dB |
e2 |
1550 MHz |
4400 MHz |
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Mini-circuits |
COMBINER |
26.99 dBm |
1.14 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
1.8 dB |
ISOLATION-MIN (DB):18 |
e0 |
1 MHz |
500 MHz |
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|
Mini-circuits |
COMBINER |
26.99 dBm |
1.14 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
TIN OVER NICKEL |
1.8 dB |
ISOLATION-MIN (DB):18 |
e3 |
1 MHz |
500 MHz |
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Api Technologies |
SPLITTER |
33.01 dBm |
1.35 |
COAXIAL |
.4 dB |
SMA-F, ISOLATION-MIN (DB):20 |
4000 MHz |
8000 MHz |
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|
Ttm Technologies |
SPLITTER |
SURFACE MOUNT |
6 |
33.01 dBm |
1.67 |
COMPONENT |
SOLCC6,.05,25 |
50 ohm |
85 Cel |
-55 Cel |
NICKEL GOLD |
.7 dB |
e4 |
950 MHz |
2150 MHz |
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|
Mini-circuits |
COMBINER |
26.99 dBm |
1.38 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin (Sn) |
2.5 dB |
ISOLATION-MIN (DB):15 |
e3 |
5 MHz |
1000 MHz |
||||||||||
Mini-circuits |
COMBINER |
26.99 dBm |
1.2 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
2.5 dB |
ISOLATION-MIN (DB):15 |
e0 |
5 MHz |
1000 MHz |
|||||||||||
|
Mini-circuits |
COMBINER |
26.99 dBm |
1.64 |
COMPONENT |
75 ohm |
85 Cel |
-40 Cel |
Tin (Sn) |
2.5 dB |
ISOLATION-MIN (DB):15 |
e3 |
10 MHz |
1000 MHz |
||||||||||
Mini-circuits |
COMBINER |
26.99 dBm |
1.64 |
COMPONENT |
75 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
2.5 dB |
ISOLATION-MIN (DB):15 |
e0 |
10 MHz |
1000 MHz |
|||||||||||
|
Mini-circuits |
SPLITTER AND COMBINER |
26.99 dBm |
1.17 |
MODULE |
50 ohm |
85 Cel |
-40 Cel |
1.4 dB |
ISOLATION-MIN (DB):16 |
5 MHz |
1000 MHz |
||||||||||||
|
Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
33.98 dBm |
1.5 |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
TIN SILVER OVER NICKEL |
6 dB |
3.2 dB |
ISOLATION-MIN (DB):6 |
e2 |
2000 MHz |
26500 MHz |
||||
|
Mini-circuits |
COMBINER |
26.99 dBm |
1.17 |
MODULE |
50 ohm |
85 Cel |
-40 Cel |
TIN |
1.4 dB |
ISOLATION-MIN (DB):16 |
e3 |
5 MHz |
1000 MHz |
||||||||||
Mini-circuits |
SPLITTER AND COMBINER |
26.99 dBm |
1.17 |
MODULE |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
1.4 dB |
ISOLATION-MIN (DB):16 |
e0 |
5 MHz |
1000 MHz |
|||||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
NICKEL GOLD |
.5 dB |
ISOLATION-MIN (DB):17 |
e4 |
2300 MHz |
2800 MHz |
|||||||||||
|
Mini-circuits |
SPLITTER AND COMBINER |
26.99 dBm |
2.9 |
MODULE |
50 ohm |
85 Cel |
-40 Cel |
2.1 dB |
ISOLATION-MIN (DB):8 |
50 MHz |
3000 MHz |
||||||||||||
Mini-circuits |
COMBINER |
26.99 dBm |
2.9 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
2.1 dB |
50 MHz |
3000 MHz |
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|
Analog Devices |
SPLITTER |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
105 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
75 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
e3 |
54 MHz |
865 MHz |
|||||||
Commscope |
SPLITTER |
58.45 dBm |
1.2 |
COAXIAL |
50 ohm |
7/16-F, HIGH RELIABILITY, USABLE TO 2500 MHZ |
800 MHz |
2200 MHz |
||||||||||||||||
Mini-circuits |
COMBINER |
30 dBm |
1.27 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
1 dB |
ISOLATION-MIN (DB):13 |
e0 |
150 MHz |
350 MHz |
|||||||||||
|
Mini-circuits |
COMBINER |
30 dBm |
1.27 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
1 dB |
ISOLATION-MIN (DB):13 |
150 MHz |
350 MHz |
||||||||||||
|
M/a-com Technology Solutions |
SPLITTER |
23.98 dBm |
COMPONENT |
75 ohm |
85 Cel |
-40 Cel |
3.2 dB |
ISOLATION-MIN (DB):15 |
5 MHz |
2150 MHz |
|||||||||||||
Cobham Plc |
SPLITTER |
30 dBm |
1.3 |
50 ohm |
7.5 dB |
0 MHz |
18000 MHz |
|||||||||||||||||
M/a-com Technology Solutions |
SPLITTER |
30 dBm |
1.5 |
50 ohm |
85 Cel |
-55 Cel |
.85 dB |
10 MHz |
500 MHz |
|||||||||||||||
|
Mini-circuits |
COMBINER |
30 dBm |
1.38 |
COMPONENT |
75 ohm |
85 Cel |
-40 Cel |
Tin (Sn) - with Nickel (Ni) barrier |
3 dB |
ISOLATION-MIN (DB):15 |
e3 |
10 MHz |
850 MHz |
||||||||||
Mini-circuits |
COMBINER |
30 dBm |
1.38 |
COMPONENT |
75 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
3 dB |
ISOLATION-MIN (DB):15 |
e0 |
10 MHz |
850 MHz |
|||||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Nickel/Gold (Ni/Au) |
1.3 dB |
ISOLATION-MIN (DB):13 |
e4 |
3100 MHz |
5000 MHz |
|||||||||||
|
Pulse Electronics |
SPLITTER |
SURFACE MOUNT |
6 |
1.29 |
COMPONENT |
DILCC6,.25 |
75 ohm |
85 Cel |
-40 Cel |
17 dB |
3 dB |
5 MHz |
1000 MHz |
||||||||||
M/a-com Technology Solutions |
SPLITTER |
30 dBm |
1.5 |
50 ohm |
85 Cel |
-55 Cel |
.75 dB |
.4 MHz |
400 MHz |
|||||||||||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
.7 dB |
ISOLATION-MIN (DB):17 |
1700 MHz |
2200 MHz |
|||||||||||||
Mini-circuits |
COMBINER |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
30 dBm |
1.42 |
COMPONENT |
FL8,.38,200 |
50 ohm |
RF/Microwave Splitter/Combiners |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
1.8 dB |
ISOLATION-MIN (DB):17 |
e0 |
200 MHz |
900 MHz |
||||||
|
Ttm Technologies |
SPLITTER |
33.01 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
NICKEL GOLD |
.8 dB |
ISOLATION-MIN (DB):10.5 |
e4 |
950 MHz |
2150 MHz |
|||||||||||
|
Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
6 |
PLASTIC/EPOXY |
30 dBm |
COMPONENT |
50 ohm |
TIN OVER NICKEL |
15 dB |
1.5 dB |
e3 |
20 MHz |
2000 MHz |
||||||||||
Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
6 |
30 dBm |
2.01 |
COMPONENT |
FL6,.2,100 |
50 ohm |
85 Cel |
-40 Cel |
TIN LEAD |
15 dB |
1.5 dB |
e0 |
20 MHz |
2000 MHz |
||||||||
|
Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
6 |
40 dBm |
1.29 |
COMPONENT |
SOC6,.28 |
50 ohm |
85 Cel |
-40 Cel |
Tin (Sn) - with Nickel (Ni) barrier |
17 dB |
1 dB |
TR, 7 INCH: 200 |
e3 |
2000 MHz |
2300 MHz |
||||||
Mini-circuits |
SPLITTER AND COMBINER |
40 dBm |
1.29 |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
1 dB |
ISOLATION-MIN (DB):17 |
e0 |
2000 MHz |
2300 MHz |
|||||||||||
|
Mini-circuits |
COMBINER |
22.04 dBm |
1.26 |
COAXIAL |
50 ohm |
85 Cel |
-40 Cel |
1.8 dB |
SMA |
0 MHz |
10000 MHz |
||||||||||||
|
Anaren |
SPLITTER |
40 dBm |
1.4 |
COAXIAL |
50 ohm |
.6 dB |
SMA-F, ISOLATION-MIN (DB):18 |
4000 MHz |
12000 MHz |
||||||||||||||
|
Mini-circuits |
COMBINER |
SURFACE MOUNT |
12 |
PLASTIC/EPOXY |
31.76 dBm |
1.2 |
COMPONENT |
LCC12,.12SQ,20 |
50 ohm |
85 Cel |
-40 Cel |
Tin (Sn) |
17 dB |
1.4 dB |
ISOLATION-MIN (DB):17 |
e3 |
800 MHz |
2100 MHz |
|||||
|
Mini-circuits |
SPLITTER AND COMBINER |
SURFACE MOUNT |
6 |
26.99 dBm |
1.48 |
MODULE |
75 ohm |
85 Cel |
-40 Cel |
TIN OVER NICKEL |
14 dB |
1.4 dB |
ISOLATION-MIN (DB):14 |
e3 |
5 MHz |
1000 MHz |
|||||||
Mini-circuits |
SPLITTER AND COMBINER |
26.99 dBm |
1.48 |
MODULE |
75 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
1.4 dB |
ISOLATION-MIN (DB):14 |
e0 |
5 MHz |
1000 MHz |
|||||||||||
Mini-circuits |
COMBINER |
26.99 dBm |
1.48 |
COMPONENT |
75 ohm |
85 Cel |
-40 Cel |
1.4 dB |
5 MHz |
1000 MHz |
||||||||||||||
|
Mini-circuits |
SPLITTER AND COMBINER |
26.99 dBm |
1.48 |
MODULE |
75 ohm |
85 Cel |
-40 Cel |
TIN OVER NICKEL |
1.4 dB |
ISOLATION-MIN (DB):14 |
e3 |
5 MHz |
1000 MHz |
RF/Microwave splitter/combiners are electronic devices used to divide or combine high frequency signals in radio frequency (RF) and microwave applications. They are commonly used in RF and microwave communication systems, antennas, and radar systems.
A splitter is a device that takes a single input signal and divides it into multiple output signals. A combiner, on the other hand, takes multiple input signals and combines them into a single output signal. Splitter/combiners can be designed to split or combine signals evenly or with specific power ratios, depending on the application.
Splitter/combiners can be made with a variety of technologies, including microstrip, stripline, and waveguide. Microstrip and stripline technologies are commonly used for lower frequency applications, while waveguide is used for higher frequency applications. Some splitter/combiners are also designed to operate over a wide bandwidth, allowing them to be used for multiple frequency bands.
Splitter/combiners are essential components in RF and microwave systems, allowing for efficient distribution of signals and combining of signals for transmission or reception. They are often used in conjunction with amplifiers, filters, and other RF and microwave components to achieve optimal system performance.