Texas Instruments - LMV225UR/NOPB

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LMV225UR/NOPB by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number LMV225UR/NOPB
Description RF AND BASEBAND CIRCUIT; Terminal Form: BALL; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; Terminal Position: BOTTOM;
Datasheet LMV225UR/NOPB Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s): 30
Telecom IC Type: RF AND BASEBAND CIRCUIT
Surface Mount: YES
Maximum Supply Current: 8 mA
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
No. of Functions: 1
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code: S-XBGA-B4
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): 260
No. of Channels: 1
Package Code: VFBGA
Moisture Sensitivity Level (MSL): 1
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