Image shown is a representation only.
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | LMV226TLX/NOPB |
| Description | RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; |
| Datasheet | LMV226TLX/NOPB Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Surface Mount: | YES |
| Maximum Supply Current: | 8 mA |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| JESD-30 Code: | R-XBGA-B4 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| No. of Channels: | 1 |
| Package Code: | VFBGA |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |
