Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
UPB1005K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N36		1 mm	6 mm	Not Qualified	e0			6 mm
HD155131TF	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	56	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK				75 Cel	-20 Cel		QUAD	R-PQFP-G56				Not Qualified
HFA3600IB	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
F5280AVGK	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM	S-PBGA-B49	3				e3	NOT SPECIFIED	260
UPC8195K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
UPC8158K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0376 mA	3 V	3	CHIP CARRIER	LCC28,.20X.22,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-N28		1.05 mm	5.1 mm	Not Qualified	e0			5.5 mm
UPC8186K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.041 mA	3 V	3	CHIP CARRIER	LCC24,.16X.2,20	Other Telecom ICs	.5 mm	80 Cel	-30 Cel	TIN LEAD	QUAD	R-PQCC-N24		1.05 mm	4.1 mm	Not Qualified	e0			5.1 mm
UPC8194K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
ISL5216KI-1Z	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
ISL5216KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm		e0			12 mm
ISL5217KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
F0453CLFGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT																			TIN			3				e3		260
F5280AVGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	49	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				GRID ARRAY				105 Cel	-40 Cel	Tin (Sn)	BOTTOM	S-PBGA-B49	3				e3	NOT SPECIFIED	260
UPG2130TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
F6101NTGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	40		SQUARE		YES	1	BICMOS								95 Cel	-40 Cel	TIN	QUAD	S-XQCC-N40	1				e3		260
HD155101BF	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
F0452CLEGK	Renesas Electronics	RF AND BASEBAND CIRCUIT
HSP50216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm	Not Qualified	e1			12 mm
F159VNLGN	Renesas Electronics	RF AND BASEBAND CIRCUIT																			TIN			3				e3		260
UPC8190K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
UPB1005K	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N36		1 mm	6 mm	Not Qualified	e0			6 mm
F0448NBGK8	Renesas Electronics	RF AND BASEBAND CIRCUIT																			TIN			1				e3		260
ISL5216KI-1	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
UPG174TA-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.53 mm	1.5 mm		e0			2.9 mm
ISL5416KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm		e1			17 mm
F0440NBGI8	Renesas Electronics	RF AND BASEBAND CIRCUIT																			Tin (Sn)			1				e3	NOT SPECIFIED	260
UPC8195K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
F0443LGRI	Renesas Electronics	RF AND BASEBAND CIRCUIT																			GOLD			3				e4		260
F159VNLGN8	Renesas Electronics	RF AND BASEBAND CIRCUIT																			TIN			3				e3		260
IDTF1130NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N48		.8 mm	7 mm					7 mm
F0443LGRI8	Renesas Electronics	RF AND BASEBAND CIRCUIT																			GOLD			3				e4		260
UPC8112TB-E3-A	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e6			2 mm
82V3395NLG	Renesas Electronics
F0440NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT																			Tin (Sn)			1				e3	NOT SPECIFIED	260
F0452BLEGK	Renesas Electronics	RF AND BASEBAND CIRCUIT																			Tin (Sn)			3				e3	NOT SPECIFIED	260
UPG2106TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
F1180NBGI	Renesas Electronics	RF AND BASEBAND CIRCUIT		NO LEAD	48	HVQCCN	SQUARE		YES	1		410 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3		260	7 mm
UPC8191K-E1	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-25 Cel		QUAD	R-PQCC-N20		.9 mm	3 mm					4 mm
ISL5416KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm		e0	20	220	17 mm
UPG2110TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
F6102NTGK	Renesas Electronics																				TIN			1				e3		260
F0448NBGK	Renesas Electronics	RF AND BASEBAND CIRCUIT																			TIN			1				e3		260
UPG2126TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
ISL5217KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
F6102NTGK8	Renesas Electronics																				TIN			1				e3		260
82V3395BNLG8	Renesas Electronics	RF AND BASEBAND CIRCUIT
MG2455-F48	Littelfuse	RF AND BASEBAND CIRCUIT
RP-M110A	Littelfuse	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	45		RECTANGULAR	UNSPECIFIED	YES	1			1.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	R-XQMA-N45		2.6 mm	14.9 mm					17.9 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.