Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX9981ETX+D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e3			6 mm
MAX2047ETJ	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e0			5 mm
MAX2360ECM+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2530ETI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2362ECM+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2538EGI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT																			TIN LEAD			1				e0
MAX2367EGM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1			2.75 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48		1 mm	7 mm	Not Qualified	e0			7 mm
MAX2904EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.5 V	2.7/4.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2902EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.5 V	2.7/4.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2391ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	RECTANGULAR	UNSPECIFIED	YES		BICMOS	.04 mA	3 V	3	CHIP CARRIER	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	R-XQCC-N28	1			Not Qualified	e0
MAX9990ETP-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX9990ETP+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX2388EGC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.9 mm	3 mm	Not Qualified	e0			3 mm
MAX2029ETP-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified				5 mm
MAX2307EBC	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified	e0			2.02 mm
MAX2202EWT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.69 mm	.865 mm	Not Qualified		30	260	1.27 mm
MAX2365EGM-TD	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	1 mm	7 mm		e0			7 mm
MAX2901ETI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2460EAI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3	30	260	10.2 mm
MAX2369EGM-D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0			7 mm
MAX2440EAI+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3	30	260	10.2 mm
MAX2620E/D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	BIPOLAR		3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER	X-XUUC-N	1			Not Qualified	e0	20	240
MAX2363ETM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0			7 mm
MAX2367EGM-TD	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1			2.75 V		CHIP CARRIER				85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1				e0
MAX2367EGM	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	UNSPECIFIED	YES	1			2.75 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e0			7 mm
MAX2531EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT																			TIN LEAD			1				e0
MAX2391ETI+T	Maxim Integrated	RF AND BASEBAND CIRCUIT																			MATTE TIN			1				e3	30	260
MAX2531EGI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT																			TIN LEAD			1				e0
MAX2364ECM+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.75 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
MAX2058ETL	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N40	1	.8 mm	6 mm	Not Qualified	e0			6 mm
MAX2307EBC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B12	1	.67 mm	1.54 mm	Not Qualified				2.02 mm
MAX9981ETX-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36		.8 mm	6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6 mm
MAX2363ETM+T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX2902EGI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1			4.5 V	2.7/4.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2310EEI+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2358EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		2.75 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2021ETX-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.315 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36		.8 mm	6 mm	Not Qualified	e0			6 mm
MAX2420EAI+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.99 mm	5.29 mm	Not Qualified	e3	30	260	10.2 mm
MAX2202EMT+T10	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.69 mm	.865 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	1.27 mm
MAX2361EGM-D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	1 mm	7 mm	Not Qualified	e0			7 mm
MAX2310EEI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2359EGI	Maxim Integrated	RF AND BASEBAND CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
MAX2047ETJ+T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3			5 mm
MAX9982ETP	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX2530EGI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
MAX2363ETM+	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.09 mA	2.8 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX2391ETI-T	Maxim Integrated	RF AND BASEBAND CIRCUIT																			MATTE TIN			1				e3	30	260
MAX2366EGM-D	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	1 mm	7 mm	Not Qualified	e0			7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.