Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ACFM-9025-TR1	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY			2.15 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N5		1.1 mm	4 mm					7 mm
ALM-2203-BLKG	Broadcom	RF AND BASEBAND CIRCUIT
WS1405-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8	HQCCN	SQUARE		YES	1		520 mA	3.4 V		CHIP CARRIER, HEAT SINK/SLUG	SOLCC8,.16,32		.8 mm	85 Cel	-30 Cel		DUAL	S-XQCC-N8		1.1 mm	3 mm					3 mm
ACFM-7109-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4			5 mm
ACPM-9001-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	10	DMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY							DUAL	R-XDMA-N10		.92 mm	2 mm					2.5 mm
AJAV-5501-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	10	HLGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		GRID ARRAY, HEAT SINK/SLUG			.6 mm	90 Cel	-30 Cel		BOTTOM	S-PBGA-B10	3	1.1 mm	3 mm				260	3 mm
ALM-2712-SG1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER			1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm
ALM-3012-BLK	Broadcom	RF FRONT END CIRCUIT																						3						260
ACPM-7081-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24		1 mm	5 mm					7.5 mm
ACMD-4102-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	9	QCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-20 Cel	GOLD	BOTTOM	S-XBCC-N9	3	1.05 mm	2.4 mm	Not Qualified	e4			2.4 mm
ACPM-5252-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		CHIP CARRIER			.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7081-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24		1 mm	5 mm					7.5 mm
ACPM-7353-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1 mm	4 mm				260	5 mm
ACFM-7107-BLK	Broadcom	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY			2.15 mm	85 Cel	-40 Cel	GOLD	DUAL	R-XDMA-N5	3	1.1 mm	4 mm		e4			7 mm
ACPM-7251-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		MICROELECTRONIC ASSEMBLY			.64 mm				QUAD	R-XQMA-N24		1 mm	5 mm					7.5 mm
ALM-2712-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER			1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm
ACPM-7800-TR1	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	42		RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY							QUAD	R-XQMA-B42	3	1 mm	5 mm				260	7 mm
ACFM-7104-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	7		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel	GOLD	UNSPECIFIED	R-XXMA-X7	3	1.2 mm	4 mm	Not Qualified	e4			7 mm
ALM-2506-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm				DUAL	S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
ACPM-5281-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		CHIP CARRIER			.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACMD-7610-BLK	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES						UNCASED CHIP						GOLD	UPPER	R-XUUC-N8	3			Not Qualified	e4
ACFM-7325-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.2 mm	4 mm		e4			7 mm
ALM-1522-BLKG	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			5 V		MICROELECTRONIC ASSEMBLY							QUAD	R-XQMA-N22	2			Not Qualified			260
ALM-2712-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.7 V		CHIP CARRIER			1.25 mm				BOTTOM	R-XBCC-B12	3	1.1 mm	2.5 mm	Not Qualified			260	3 mm
ACPM-7831-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1			3.4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
W3013BCL	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
ACMD-7610-TR1	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES						UNCASED CHIP						GOLD	UPPER	R-XUUC-N8	3			Not Qualified	e4
HPMX-7202-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.55 mm	5 mm	Not Qualified	e0			5 mm
ACPM-7831-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1			3.4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN LEAD	DUAL	R-XDMA-N6				Not Qualified	e0
ACFM-7107-TR1	Broadcom	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY			2.15 mm	85 Cel	-40 Cel	GOLD	DUAL	R-XDMA-N5	3	1.1 mm	4 mm		e4			7 mm
ACFM-7110-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4			5 mm
LUCW3030ACA	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
ACPM-5281-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	BUTT	14	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3.4 V		CHIP CARRIER			.73 mm	85 Cel	-20 Cel	GOLD	BOTTOM	R-XBCC-B14	3	1.1 mm	4 mm	Not Qualified	e4		260	5 mm
ACPM-7355-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	2	BIPOLAR		3.4 V		MICROELECTRONIC ASSEMBLY			.73 mm	85 Cel	-30 Cel		DUAL	R-XDMA-N14	3	1.05 mm	4 mm				260	5 mm
ACFM-7103-TR1	Broadcom	RF FRONT END CIRCUIT		NO LEAD	7		RECTANGULAR	UNSPECIFIED	NO						MICROELECTRONIC ASSEMBLY							DUAL	R-XDMA-N7
ACFM-7110-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4			5 mm
AJAV-5505-BLK	Broadcom	RF AND BASEBAND CIRCUIT																			TIN			1				e3		260
ALM-1522-TR2G	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			5 V		MICROELECTRONIC ASSEMBLY							QUAD	R-XQMA-N22	2			Not Qualified			260
ACFM-7109-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5	QCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER				85 Cel	-40 Cel	GOLD	QUAD	R-XQCC-N5	3	1.05 mm	3 mm		e4			5 mm
AJAV-5602-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
ACPM-7788-TR1	Broadcom	RF FRONT END CIRCUIT		NO LEAD	42		RECTANGULAR		YES	1												QUAD	R-XQCC-N42		.9 mm	5 mm					7 mm
AJAV-5601-BLK	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
AJAV-5508-TR1	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	90 Cel	-30 Cel	TIN	DUAL	S-PDSO-N10	1	.9 mm	3 mm		e3		260	3 mm
S1M8656A01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	48	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B48		.8 mm	7 mm	Not Qualified				7 mm
S1M8657X01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	48	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B48		.8 mm	7 mm	Not Qualified				7 mm
S1T8536X01-T0R0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-10 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8659X01-F0T0	Samsung	RF AND BASEBAND CIRCUIT	OTHER	BUTT	32	BCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3 V		CHIP CARRIER			.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B32			5 mm	Not Qualified				5 mm
S1M8674X01-G0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	24	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	80 Cel	-30 Cel		QUAD	R-PQCC-N24		1 mm	3.5 mm	Not Qualified				4.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.