Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Width | Qualification | Companding Law | Input Type | Additional Features | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.09 mA |
2.8 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e3 |
30 |
260 |
10.2 mm |
||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
BICMOS |
.04 mA |
3 V |
3 |
CHIP CARRIER |
LCC28,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-XQCC-N28 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||||
|
Maxim Integrated |
BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
5 mm |
|||||||||||||||||||||||
Maxim Integrated |
BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0415 mA |
2.75 V |
3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e0 |
9.89 mm |
||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
10.2 mm |
||||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.75 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N28 |
1 |
.9 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.75 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N28 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e3 |
30 |
260 |
10.2 mm |
|||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
10.2 mm |
||||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
10.2 mm |
|||||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.15 mA |
5 V |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.20SQ,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.75 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N28 |
.9 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.75 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N28 |
1 |
.9 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.14 mA |
5 V |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e0 |
6 mm |
|||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.14 mA |
5 V |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e3 |
30 |
260 |
6 mm |
||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
MATTE TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e3 |
10.2 mm |
|||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
4.5 V |
2.7/4.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N28 |
1 |
.9 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
TIN LEAD |
1 |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.09 mA |
2.8 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
BICMOS |
.038 mA |
3 V |
3 |
CHIP CARRIER |
LCC28,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-XQCC-N28 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||
Maxim Integrated |
BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
.315 mA |
5 V |
5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC36,.25SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e0 |
245 |
6 mm |
||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
1.99 mm |
5.29 mm |
Not Qualified |
e0 |
10.2 mm |
||||||||||||||||||||||||
|
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e3 |
30 |
260 |
10.2 mm |
||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.75 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N28 |
1 |
.9 mm |
5 mm |
Not Qualified |
e0 |
5 mm |
|||||||||||||||||||||||
Maxim Integrated |
BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
6.5 mm |
|||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
Not Qualified |
e0 |
6 mm |
|||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
5 mm |
Not Qualified |
e0 |
245 |
5 mm |
||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
2.75 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||||||||||||||||
Maxim Integrated |
RF AND BASEBAND CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
Tin (Sn) |
3 |
e3 |
NOT SPECIFIED |
260 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1.1 mm |
1.25 mm |
Not Qualified |
e0 |
2 mm |
||||||||||||||||||||||||
|
Renesas Electronics |
RF FRONT END CIRCUIT |
TIN |
3 |
e3 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
RF FRONT END CIRCUIT |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
FLATPACK |
.5 mm |
QUAD |
S-PQFP-G48 |
1.7 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
RF FRONT END CIRCUIT |
TIN |
3 |
e3 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1.1 mm |
1.25 mm |
Not Qualified |
e0 |
2 mm |
||||||||||||||||||||||||
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
75 Cel |
-20 Cel |
QUAD |
S-PQFP-G48 |
1.7 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||||||||||||||||
Renesas Electronics |
RF FRONT END CIRCUIT |
OTHER |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
90 Cel |
-30 Cel |
DUAL |
R-PDSO-G6 |
1.1 mm |
1.25 mm |
2 mm |
||||||||||||||||||||||||||||
|
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
TIN |
3 |
e3 |
260 |
|||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
OTHER |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GAAS |
.0045 mA |
2.8 V |
2.8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
Other Telecom ICs |
.65 mm |
90 Cel |
-30 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G6 |
1.1 mm |
1.25 mm |
Not Qualified |
e0 |
2 mm |
||||||||||||||||||||
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
BASEBAND CIRCUIT |
OTHER |
NO LEAD |
20 |
VQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.0126 mA |
3 V |
3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC20,.12X.16,16 |
Other Telecom ICs |
.4 mm |
85 Cel |
-25 Cel |
TIN LEAD |
QUAD |
R-PQCC-N20 |
.9 mm |
3 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3 V |
3/3.3,3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Other Telecom ICs |
.5 mm |
75 Cel |
-20 Cel |
QUAD |
S-PQFP-G48 |
1.7 mm |
7 mm |
Not Qualified |
7 mm |
|||||||||||||||||||||||
Renesas Electronics |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.4 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N48 |
.9 mm |
7 mm |
Not Qualified |
7 mm |
Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.
Some common types of cellphone ICs include:
1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.
2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.
3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.
5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.