Multi-functional Peripherals

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Manufacturers
Peripheral IC Type
Temperature Grade
Terminal Form
No. of Terminals
Package Code
Package Shape
Package Body Material
Integrated Cache
Surface Mount
Maximum Supply Voltage
On Chip Data RAM Width
Screening Level
Address Bus Width
DAC Channels
Bit Size
Power Supplies (V)
Package Style (Meter)
Package Equivalence Code
Minimum Supply Voltage
Maximum Operating Temperature
CPU Family
No. of External Interrupts
Minimum Operating Temperature
Terminal Finish
ADC Channels
Ultraviolet Erasable
Terminal Position
DMA Channels
Maximum Seated Height
ROM Words
RAM Words
Width
Data EEPROM Size
Additional Features
Boundary Scan
Peripherals
External Data Bus Width
Maximum Clock Frequency
Maximum Time At Peak Reflow Temperature (s)
Peak Reflow Temperature (C)
Length
ROM Bits Size
No. of Timers
RAM Bytes
Technology
Analog To Digital Convertors
Maximum Supply Current
Nominal Supply Voltage
No. of DMA Channels
PWM Channels
No. of Serial I/Os
Sub-Category
Connectivity
ROM Programmability
Bus Compatibility
Terminal Pitch
Format
JESD-30 Code
Moisture Sensitivity Level (MSL)
Qualification
Speed
Low Power Mode
JESD-609 Code
Maximum Standby Current
On Chip Program ROM Width
No. of I/O Lines
Maximum Access Time
Reset All
Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

DRF402CIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRB404HSBIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRI402CIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

TDA2PSXTQABZQ1

Texas Instruments

AUTOMOTIVE

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

247

TDA2EGAHQABCQ1

Texas Instruments

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

215

DRF404BIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRF402BIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

TDA2PHVDQACDRQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

XTDA2PSXVQACD

Texas Instruments

DRF402BIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRI404HSCIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA404IPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRB402AIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

TDA3MASBABFRQ1

Texas Instruments

MULTIFUNCTION PERIPHERAL

AUTOMOTIVE

BALL

367

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.11 V

AEC-Q100

16

GRID ARRAY, FINE PITCH

BGA367,22X22,25

1.02 V

125 Cel

-40 Cel

BOTTOM

2.82 mm

524288

15 mm

YES

32

38.4 MHz

15 mm

CMOS

1.06 V

13

CAN(2), I2C(2), QSPI, SPI(4), UART(3)

.65 mm

S-PBGA-B367

126

DRI404HSIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRH404HSCIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA404BIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA404BIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRF404BIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRF404HSAIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRI402AIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRI404BIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

CC1111F16RSPR

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

CMOS

.5 mm

S-XQCC-N36

3

Not Qualified

e4

DRF404CIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRB402CIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRB402CIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA725AGGABCRQ1

Texas Instruments

MICROPROCESSOR, RISC

AUTOMOTIVE

BALL

760

FBGA

SQUARE

PLASTIC/EPOXY

NO

YES

1.2 V

8

AEC-Q100

16

GRID ARRAY, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.96 mm

512K

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

FIXED POINT

S-PBGA-B760

3

1176 rpm

YES

e1

215

DRE404CIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA716BGGCBDRQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

38.4 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

800 rpm

e1

186

DRA710BEGCBDQ1

Texas Instruments

AUTOMOTIVE

BALL

538

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.298 mm

512K

17 mm

YES

32

32 MHz

30

260

17 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.65 mm

S-PBGA-B538

3

600 rpm

e1

186

DRF402IZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA404IZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRF404HSIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

TDA2PSXTQABZRQ1

Texas Instruments

AUTOMOTIVE

BALL

760

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B760

3

e1

247

DRI402CIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA402AIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRB402IPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRB402BIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRF402IPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRI404HSIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRA773PSGACDQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

32

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

64

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; SPI; UART; USB

.8 mm

S-PBGA-B784

3

1800 rpm

e1

247

DRA404CIZDU

Texas Instruments

MULTIFUNCTION PERIPHERAL

CC1111F16RSP

Texas Instruments

OTHER

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NICKEL PALLADIUM GOLD

QUAD

.9 mm

6 mm

30

260

6 mm

CMOS

.5 mm

S-XQCC-N36

3

Not Qualified

e4

X66AK2G12ABY60

Texas Instruments

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

625

LFBGA

SQUARE

PLASTIC/EPOXY

YES

.945 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA625,25X25,32

.855 V

70 Cel

0 Cel

BOTTOM

1.56 mm

1M

21 mm

YES

32

21 mm

CMOS

.9 V

CAN; ETHERNET; I2C; PCI; SPI; UART; USB

.8 mm

S-PBGA-B625

212

DRE404BIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

DRI404CIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

TDA2PHVRQACDRQ1

Texas Instruments

AUTOMOTIVE

BALL

784

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.2 V

AEC-Q100

16

GRID ARRAY, LOW PROFILE, FINE PITCH

1.11 V

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.63 mm

2.5M

23 mm

YES

32

38.4 MHz

30

250

23 mm

CMOS

1.15 V

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

.8 mm

S-PBGA-B784

3

e1

247

DRA404HSBIPTP

Texas Instruments

MULTIFUNCTION PERIPHERAL

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.