Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8192 |
512 |
7 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
7 mm |
1024 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
16384 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
8 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
1.71 V |
85 Cel |
M8C |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
32768 |
1024 |
7 mm |
NO |
0 |
25.2 MHz |
20 |
260 |
7 mm |
2048 |
CMOS |
4 mA |
3 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
25.2 rpm |
e4 |
36 |
|||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
2.7/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
4096 |
256 |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
NO |
0 |
24.6 MHz |
40 |
260 |
5 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
USB |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
24 rpm |
e4 |
24 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
3.3/5 |
SMALL OUTLINE |
SOP20,.4 |
3 V |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
N |
DUAL |
2.667 mm |
256 |
7.505 mm |
NO |
0 |
.032768 MHz |
20 |
260 |
12.8265 mm |
8192 Bits |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G20 |
3 |
Not Qualified |
e4 |
.000005 Amp |
16 |
||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
3.3/5 |
IN-LINE |
DIP8,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
MATTE TIN |
DUAL |
4.572 mm |
16384 |
256 |
7.62 mm |
ALSO OPERATES AT 3V WITH 93KHZ |
NO |
0 |
24 MHz |
260 |
9.779 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
2.54 mm |
R-PDIP-T8 |
1 |
Not Qualified |
24 rpm |
e3 |
6 |
|||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
SMALL OUTLINE |
SOP20,.4 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.667 mm |
16384 |
256 |
7.505 mm |
ALSO OPERATES AT 3V WITH 93KHZ |
NO |
0 |
24 MHz |
20 |
260 |
12.8265 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
1.27 mm |
R-PDSO-G20 |
3 |
Not Qualified |
24 rpm |
e4 |
16 |
||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
8 |
3.3/5 |
IN-LINE |
DIP28,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
4.82 mm |
16384 |
256 |
7.62 mm |
ALSO OPERATES AT 3V WITH 93KHZ |
NO |
0 |
24 MHz |
40 |
260 |
34.67 mm |
256 |
CMOS |
8 mA |
5 V |
Microcontrollers |
FLASH |
I2C; USB |
2.54 mm |
R-PDIP-T28 |
1 |
Not Qualified |
24 rpm |
e4 |
24 |
||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
0 |
8 |
3.3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
16384 |
1024 |
7 mm |
ALSO OPERATES AT 3V MINIMUM SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
7 mm |
1024 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
I2C, IRDA, SPI, UART, USB |
.5 mm |
S-XQCC-N48 |
3 |
Not Qualified |
24 rpm |
e4 |
44 |
|||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
8 |
3.3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
4.75 V |
85 Cel |
M8C |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 mm |
32768 |
1024 |
5.3 mm |
ALSO OPERATES AT 3V SUPPLY |
NO |
0 |
24 MHz |
20 |
260 |
10.2 mm |
2048 |
CMOS |
14 mA |
5 V |
Microcontrollers |
FLASH |
USB |
.65 mm |
R-PDSO-G28 |
3 |
Not Qualified |
24 rpm |
e4 |
24 |
||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
8 |
2/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
85 Cel |
8051 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
65536 |
4096 |
14 mm |
YES |
0 |
67 MHz |
40 |
260 |
14 mm |
8192 |
CMOS |
3.3 V |
Microcontrollers |
FLASH |
I2C; USB |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
67 rpm |
e4 |
62 |
||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
2/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.3SQ,40 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
4096 |
8 mm |
YES |
0 |
67 MHz |
30 |
260 |
8 mm |
65536 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
|||||||||||||||||||||||||||||||
|
Infineon Technologies |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TIN SILVER COPPER |
1 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
PURE TIN |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
PURE TIN |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
PURE TIN |
3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
GULL WING |
64 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
FLATPACK, LOW PROFILE |
QFP64,.63SQ,32 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
2048 |
14 mm |
NO |
48 MHz |
14 mm |
CMOS |
13.8 mA |
11 |
I2C; SPI; UART; IRDA; IDE; LIN |
.8 mm |
S-PQFP-G64 |
3 |
e4 |
51 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
4K |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
13.8 mA |
1.8 V |
3 |
I2C |
.5 mm |
S-PQFP-G48 |
3 |
36 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64(UNSPEC) |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
4K |
10 mm |
NO |
0 |
48 MHz |
10 mm |
CMOS |
13.8 mA |
3.3 V |
11 |
I2C; SPI; UART; IRDA; IDE; LIN |
.5 mm |
S-PQFP-G64 |
3 |
e4 |
51 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
2048 |
8 mm |
NO |
0 |
48 MHz |
8 mm |
CMOS |
3.3 V |
I2C; SPI; UART; IRDA; IDE; LIN |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
55 |
||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
2048 |
8 mm |
NO |
48 MHz |
8 mm |
CMOS |
13.8 mA |
11 |
I2C; SPI; UART; IRDA; IDE; LIN |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
55 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
68 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
4096 |
8 mm |
NO |
48 MHz |
8 mm |
CMOS |
13.8 mA |
11 |
I2C; SPI; UART; IRDA; IDE; LIN |
.4 mm |
S-XQCC-N68 |
3 |
e4 |
55 |
|||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
NO LEAD |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
1.8 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
1.6 mm |
8192 |
10 mm |
NO |
48 MHz |
10 mm |
CMOS |
14.5 mA |
I2C; IRDA; LIN; SPI; UART; USB |
.5 mm |
S-PQFP-G64 |
3 |
53 |
|||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MULTIFUNCTION PERIPHERAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64(UNSPEC) |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1.6 mm |
16K |
10 mm |
NO |
0 |
48 MHz |
10 mm |
CMOS |
13.8 mA |
3.3 V |
11 |
I2C; SPI; UART; IRDA; IDE; LIN |
.5 mm |
S-PQFP-G64 |
3 |
e4 |
51 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
PURE TIN |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; SPI; UART; IRDA; LIN; IDE |
.4 mm |
S-XQCC-N56 |
3 |
36 |
|||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
1.8/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
N |
QUAD |
1 mm |
32768 |
8 mm |
YES |
0 |
40 MHz |
260 |
8 mm |
65536 Bits |
CMOS |
1.8 V |
Other Microprocessor ICs |
.4 mm |
S-XQCC-N68 |
3 |
Not Qualified |
e4 |
48 |
||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
3/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
2.7 V |
85 Cel |
-40 Cel |
N |
QUAD |
1 mm |
32768 |
8 mm |
NO |
25 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
2097152 Bits |
CMOS |
5 V |
Other Microprocessor ICs |
I2C; USB |
.4 mm |
S-XQCC-N68 |
Not Qualified |
46 |
|||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
BALL |
99 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
BOTTOM |
.6 mm |
32768 |
5.192 mm |
YES |
33 MHz |
5.94 mm |
CMOS |
1.8 V |
I2C; USB |
.5 mm |
R-PBGA-B99 |
62 |
|||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
1.8/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.71 V |
105 Cel |
-40 Cel |
N |
QUAD |
1.6 mm |
32768 |
14 mm |
YES |
0 |
33 MHz |
14 mm |
524288 Bits |
CMOS |
3.3 V |
Other uPs/uCs/Peripheral ICs |
I2C; I2S, LIN; PS/2; SPI, USB |
.5 mm |
S-PQFP-G100 |
Not Qualified |
62 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
8192 |
7 mm |
YES |
48 MHz |
7 mm |
CMOS |
1.8 V |
I2C |
.4 mm |
S-XQCC-N56 |
36 |
|||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
INDUSTRIAL |
BALL |
68 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.71 V |
85 Cel |
-40 Cel |
BOTTOM |
.55 mm |
8192 |
3.52 mm |
YES |
48 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
3.91 mm |
CMOS |
1.8 V |
I2C; USB |
.4 mm |
R-PBGA-B68 |
36 |
|||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.71 V |
85 Cel |
-40 Cel |
QUAD |
.6 mm |
16384 |
7 mm |
NO |
0 |
48 MHz |
7 mm |
CMOS |
3.3 V |
I2C; I2S; IDE; IRDA; LIN; SPI; UART |
.4 mm |
S-XQCC-N56 |
36 |
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Silicon Labs |
MULTIFUNCTION PERIPHERAL |
AUTOMOTIVE |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.16SQ,16 |
1.71 V |
125 Cel |
-40 Cel |
QUAD |
.9 mm |
98304 |
4 mm |
NO |
0 |
38.4 MHz |
4 mm |
CMOS |
3 V |
3 |
I2C, I2S, IRDA, SPI, UART, USART |
.4 mm |
S-XQCC-N32 |
20 |
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Silicon Labs |
SYSTEM ON CHIP |
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Silicon Labs |
SYSTEM ON CHIP |
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Silicon Labs |
SYSTEM ON CHIP |
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Silicon Labs |
SYSTEM ON CHIP |
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Silicon Labs |
SYSTEM ON CHIP |
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SYSTEM ON CHIP |
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Intel |
BALL |
421 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
32 |
GRID ARRAY |
1.425 V |
BOTTOM |
2.59 mm |
256 |
31 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
32 |
66 MHz |
31 mm |
CMOS |
1.5 V |
PCI; USB; LPC |
1.27 mm |
S-PBGA-B421 |
1 |
29 |
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Intel |
CMOS |
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Intel |
CMOS |
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Intel |
BALL |
1284 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
GRID ARRAY |
BOTTOM |
NO |
CMOS |
PCI; SATA; SMBUS; UART; USB |
S-PBGA-B1284 |
38 |
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Silicon Labs |
Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.
MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.
One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.
In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.