Multi-functional Peripherals

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MIMX8UX5AVLFZAC	NXP Semiconductors	MULTIFUNCTION PERIPHERAL	AUTOMOTIVE	BALL	609	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, FINE PITCH	BGA609,35X35,32	1.05 V	125 Cel		-40 Cel	TIN SILVER		BOTTOM	2.52 mm		512K	21 mm		YES		24 MHz	40	260	21 mm			CMOS	5000 mA	1.1 V				CAN(3), SAI(4), SPI(4), UART(6)	.8 mm		S-PBGA-B609	3				e2	99
CY8C20436A-24LQXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	0	8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	5 mm		NO	0	25.2 MHz	40	260	5 mm		1024	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N32	3	Not Qualified	25.2 rpm		e4	28
CY8C4145LQI-PS423	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			NICKEL PALLADIUM GOLD																										3				e4
CY8C4247AZI-L423	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.8 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		8192	7 mm		NO		48 MHz			7 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.5 mm		S-PQFP-G48	3					38
CY8C6247FDI-D32T	Infineon Technologies																															NOT SPECIFIED	NOT SPECIFIED
A82380-20	Rochester Electronics			PIN/PEG	132	PGA	SQUARE	CERAMIC, METAL-SEALED COFIRED		NO					GRID ARRAY								PERPENDICULAR				36.802 mm		NO		20 MHz	NOT SPECIFIED	NOT SPECIFIED	36.802 mm			CHMOS						80386	2.54 mm		S-CPGA-P132						0
CY8C4145LQI-PS433	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			NICKEL PALLADIUM GOLD																										3				e4
CY8C5288FNI-LP213T	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	.6 mm		32768	5.192 mm		YES	0	33 MHz			5.94 mm			CMOS		3.3 V				I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.5 mm		R-PBGA-B99	1				e1	62
LS1046AFE8MQA	Teledyne E2v (Uk)
MCIMX6Y2DVK09AB	NXP Semiconductors																															40	260														3
DW82801HBMSLJ4Y	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES		32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40							BOTTOM	2.49 mm			31 mm	PITCH_MINI	NO	32	48 MHz			31 mm			CMOS		1.05 V		Other uPs/uCs/Peripheral ICs		USB; PCI; I2C	1 mm		S-PBGA-B676		Not Qualified
MCIMX6Q7CZK08AE	NXP Semiconductors																				TIN SILVER COPPER											40	260														3				e1
NH82801HBMSLB9A	Intel			BALL	676	BGA	SQUARE	PLASTIC/EPOXY		YES		32		1.05,1.5,3.3,5	GRID ARRAY	BGA676,29X29,40							BOTTOM	2.49 mm			31 mm	PITCH_MINI	NO	32	48 MHz			31 mm			CMOS		1.05 V		Other uPs/uCs/Peripheral ICs		USB; PCI; I2C	1 mm		S-PBGA-B676		Not Qualified
CY8C6347FMI-BLD43T	Infineon Technologies																				TIN SILVER COPPER																										1				e1
EFR32FG23A010F256GM48-B	Silicon Labs	SYSTEM ON CHIP
66AK2H06DAAWA24	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V	32			GRID ARRAY		.95 V	100 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	3.62 mm		6M	40 mm		YES	128		30	245	40 mm			CMOS		1 V				ETHERNET; I2C; PCI; SPI; UART; USB	1 mm		S-PBGA-B1517	4				e1	32
CY8C27243-24PVXI	Infineon Technologies		INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V	0	8	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm	16384	256	5.3 mm	ALSO OPERATES AT 3V WITH 93KHZ	NO	0	24 MHz	30	260	7.2 mm		256	CMOS	8 mA	5 V		Microcontrollers	FLASH	I2C; USB	.65 mm		R-PDSO-G20	3	Not Qualified	24 rpm		e4	16
CY8C4014LQI-412	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	24	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG	LCC24,.16SQ,20	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.55 mm		1024	4 mm		NO		16 MHz	30	260	4 mm			CMOS	4.5 mA	3.3 V				I2C	.5 mm		S-XQCC-N24	3				e4	20
CY8C5868AXI-LP031	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V			2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz	30	260	14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm		S-PQFP-G100	3	Not Qualified			e3	70
EFR32FG23A020F256GM40-B	Silicon Labs	SYSTEM ON CHIP
EFR32FG23B010F128GM40-B	Silicon Labs	SYSTEM ON CHIP
LH75401N0Q100C0,55	NXP Semiconductors	MULTIFUNCTION PERIPHERAL		GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V	24			FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.7 V	85 Cel		-40 Cel	Tin (Sn)		QUAD	1.6 mm		32768	20 mm	ALSO REQUIRES 3.3 V SUPPLY	YES	16	20 MHz	40	250	20 mm			CMOS	70 mA	1.8 V	5			CAN, SSP, UART(3)	.5 mm		S-PQFP-G144	3	Not Qualified			e3	76
LS1026ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14			GRID ARRAY, FINE PITCH		.87 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		.9 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8MQA	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	.93 V	14			GRID ARRAY, FINE PITCH		.87 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		.9 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MGM13P02F512GE-V2	Silicon Labs
MGM13P02F512GE-V2R	Silicon Labs
CY8C3865AXI-019	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	0		2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	QUAD	1.6 mm		2048	14 mm		YES	0	67 MHz	40	260	14 mm	32768 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			.5 mm		S-PQFP-G100	3	Not Qualified			e4	72
CY8C4014SXI-420	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE	SOP8,.25	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	1.727 mm		2K	3.8985 mm		NO		16 MHz	30	260	4.978 mm			CMOS	4.5 mA	3.3 V				I2C; USB	1.27 mm		R-PDSO-G8	3				e4	5
CY8C4124LQI-443T	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	0			CHIP CARRIER, HEAT SINK/SLUG		1.71 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		2048	10 mm		NO	0	24 MHz			10 mm			CMOS		1.8 V				I2C; SPI; UART	.8 mm		S-XQCC-N56	3				e4	34
CY8C4248LTI-L475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		16384	8 mm		NO		48 MHz			8 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.4 mm		S-XQCC-N68	3				e4	57
CY8C5888FNI-LP214	Infineon Technologies		INDUSTRIAL	BALL	99	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM	.6 mm		32768	5.192 mm		YES		33 MHz		260	5.94 mm			CMOS		1.8 V				I2C; USB	.5 mm		R-PBGA-B99	1				e4	62
CYBL10563-68FNXIT	Cypress Semiconductor		INDUSTRIAL	BALL	68	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			BOTTOM	.55 mm		8192	3.52 mm		YES		48 MHz			3.91 mm			CMOS		1.8 V				I2C	.4 mm		R-PBGA-B68						36
EFR32FG23A020F256GM48-BR	Silicon Labs	SYSTEM ON CHIP
EFR32FG23A020F512GM40-BR	Silicon Labs	SYSTEM ON CHIP
EFR32FG23B020F128GM40-B	Silicon Labs	SYSTEM ON CHIP
LS1026AXN8T1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
CC-WMX-FS7D-NN	Digi International
CY8C20236A-24LKXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	16	VQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	0	8	1.8/5	CHIP CARRIER, VERY THIN PROFILE	LCC16,.12SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	3 mm		NO	0	25.2 MHz	30	260	3 mm		1024	CMOS	4 mA	3 V		Microcontrollers	FLASH	USB	.5 mm		S-XQCC-N16	3	Not Qualified	25.2 rpm		e4	13
CY8C3866PVI-070	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V	0		2/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	DUAL	2.794 mm		4096	7.505 mm		YES	0	67 MHz	20	260	15.875 mm	65536 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs			.635 mm		R-PDSO-G48	3	Not Qualified			e4	29
CY8C4014SXI-411	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE		1.8 V	85 Cel		-40 Cel			DUAL	1.727 mm		1024	3.8985 mm		NO		16 MHz	30	260	9.893 mm			CMOS		3.3 V				I2C; USB	1.27 mm		R-PDSO-G16	3					13
CY8C4045FNI-DS402T	Infineon Technologies																															NOT SPECIFIED	NOT SPECIFIED
CY8C4045LQI-S412T	Infineon Technologies																				PURE TIN																										3
CYONS2101-LBXC	Cypress Semiconductor		OTHER	NO LEAD	42	HQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V				CHIP CARRIER, HEAT SINK/SLUG		2.7 V	45 Cel		5 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	2.46 mm		1024	8.3 mm	SEATED HT-CALCULATED	NO		25.2 MHz	20	260	8.3 mm			CMOS		3.3 V				I2C; USB	.5 mm		S-PQCC-N42	3	Not Qualified			e4	28
EFR32FG23B010F512IM48-BR	Silicon Labs	SYSTEM ON CHIP
LS1026ASN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
LS1046AXN8Q1A	NXP Semiconductors			BALL	780	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.03 V	14			GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER		BOTTOM	2.61 mm			23 mm		YES	64		30	250	23 mm			CMOS		1 V				I2C, PCI, SPI, UART, USB	.8 mm		S-PBGA-B780	3				e1	76
MCIMX233DAG4B	Freescale Semiconductor	MULTIFUNCTION PERIPHERAL	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.55 V	13			FLATPACK, LOW PROFILE, FINE PITCH		1 V	70 Cel		-10 Cel	Matte Tin (Sn)		QUAD	1.6 mm			14 mm	IT ALSO REQUIRES 1.62V-2.1V ANALOG SUPPLY	YES	16	24 MHz	40	260	14 mm			CMOS		1.35 V					.4 mm	FIXED POINT	S-PQFP-G128	3		454 rpm	YES	e3

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.