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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | CC1111F16RSP |
| Description | Multifunction Peripherals; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | CC1111F16RSP Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| JESD-609 Code: | e4 |
| No. of Terminals: | 36 |
| Qualification: | Not Qualified |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 6 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-XQCC-N36 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVQCCN |
| Width: | 6 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 3 |
