Multi-functional Peripherals

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MAXQ617V-XXXX+T

Analog Devices

MULTIFUNCTION PERIPHERAL

NOT SPECIFIED

NOT SPECIFIED

CMOS

AXM0F243-1-TX30

Onsemi

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

1.8 V

85 Cel

-40 Cel

QUAD

1 mm

4096

5 mm

NO

50 MHz

7 mm

CMOS

6.85 mA

3 V

3

I2C; SPI; UART

.5 mm

R-XQCC-N40

20

AXM0F243-1-TB05

Onsemi

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.28,20

1.8 V

85 Cel

-40 Cel

QUAD

1 mm

4096

5 mm

NO

50 MHz

7 mm

CMOS

6.85 mA

3 V

3

I2C; SPI; UART

.5 mm

R-XQCC-N40

20

PSD512B0-15UI

STMicroelectronics

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

22 MHz

14 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

40

STPCE1HEBI

STMicroelectronics

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

GRID ARRAY

2.45 V

BOTTOM

2.38 mm

35 mm

-40 TO 115 C OPERATING CASE TEMPERATURE

YES

32

14.318 MHz

35 mm

CMOS

2.5 V

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

16

ZPSD513B1-15UI

STMicroelectronics

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

1.6 mm

1024

14 mm

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

14 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000015 ns

ZPSD501B1-70LI

STMicroelectronics

INDUSTRIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

5

CHIP CARRIER, WINDOW

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

Y

QUAD

4.57 mm

512

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

36 MHz

24.105 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-CQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000007 ns

STA1275EUATR

STMicroelectronics

MULTIFUNCTION PERIPHERAL

STIH412-EJB

STMicroelectronics

ZPSD511B1-70JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

4.57 mm

1024

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

36 MHz

24.1808 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000007 ns

ZPSD501B1-15L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

512

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

ZPSD512B0-90LI

STMicroelectronics

INDUSTRIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

85 Cel

-40 Cel

QUAD

4.57 mm

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

30 MHz

24.105 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-CQCC-J68

Not Qualified

40

ZPSD501B1-90JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

4.57 mm

512

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

30 MHz

24.1808 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000009 ns

PSD512B0-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

70 Cel

0 Cel

QUAD

1.6 mm

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

22 MHz

14 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

40

ZPSD513B1-15L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

ZPSD512B0-70U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

70 Cel

0 Cel

QUAD

1.6 mm

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

36 MHz

14 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

.65 mm

S-PQFP-G80

Not Qualified

40

PSD503B1-90LI

STMicroelectronics

INDUSTRIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

85 Cel

-40 Cel

QUAD

4.57 mm

512

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

30 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

STPCD0175BTC3

STMicroelectronics

MULTIFUNCTION PERIPHERAL

COMMERCIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

0 TO 100 OPERATING CASE TEMPERATURE

NO

32

14.318 MHz

35 mm

CMOS

3.3 V

Microprocessors

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

75 rpm

e0

ZPSD513B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

ZPSD503B1-15J

STMicroelectronics

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

4.57 mm

512

24.18 mm

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

24.18 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000015 ns

MK68901N04

STMicroelectronics

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

5

5

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

5.588 mm

15.24 mm

NO

8

4 MHz

62.103 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

2.54 mm

R-PDIP-T48

Not Qualified

e0

8

ZPSD512B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

PSD501B1-90UI

STMicroelectronics

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

85 Cel

-40 Cel

QUAD

1.6 mm

512

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

30 MHz

14 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

40

STPCI2HDYC

STMicroelectronics

OTHER

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

2.5,3.3

GRID ARRAY

BGA516,26X26,50

2.45 V

85 Cel

0 Cel

BOTTOM

2.38 mm

35 mm

YES

32

14.31818 MHz

35 mm

CMOS

2.5 V

Other Microprocessor ICs

USB; PCI; ISA; PCMCIA

1.27 mm

S-PBGA-B516

Not Qualified

24

MK68901Q04

STMicroelectronics

COMMERCIAL

J BEND

52

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.25 V

5

5

CHIP CARRIER

LDCC52,.8SQ

4.75 V

70 Cel

0 Cel

TIN LEAD

QUAD

4.57 mm

19.1262 mm

NO

8

4 MHz

19.1262 mm

NMOS

180 mA

5 V

1

Other Microprocessor ICs

68000

1.27 mm

S-PQCC-J52

Not Qualified

e0

8

ZPSD513B1-90JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

4.57 mm

1024

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

30 MHz

24.1808 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000009 ns

STPCV1KEBC

STMicroelectronics

COMMERCIAL EXTENDED

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

1.8,3.3

GRID ARRAY

BGA388,26X26,50

3 V

85 Cel

0 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

YES

32

14.318 MHz

35 mm

CMOS

3.3 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PBGA-B388

Not Qualified

e0

ZPSD501B1-90LI

STMicroelectronics

INDUSTRIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

5

CHIP CARRIER, WINDOW

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

Y

QUAD

4.57 mm

512

24.105 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

30 MHz

24.105 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-CQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000009 ns

STPCC4HEBI

STMicroelectronics

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

3.3

GRID ARRAY

BGA388,26X26,40

2.45 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

YES

32

14.318 MHz

35 mm

CMOS

2.5 V

Multifunction Peripherals

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

e0

ZPSD512B0-90JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

CHIP CARRIER

4.5 V

85 Cel

-40 Cel

QUAD

4.57 mm

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

30 MHz

24.1808 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-PQCC-J68

Not Qualified

40

PSD502B1-90JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

CHIP CARRIER

4.5 V

85 Cel

-40 Cel

QUAD

4.57 mm

512

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

30 MHz

24.1808 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

40

PSD511B1-90UI

STMicroelectronics

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

85 Cel

-40 Cel

QUAD

1.6 mm

1024

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

30 MHz

14 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

40

PSD511B1-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

1024

14 mm

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

14 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000015 ns

ZPSD503B1-15JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

4.57 mm

512

24.18 mm

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

24.18 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000015 ns

ZPSD502B1-90JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

4.57 mm

512

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

30 MHz

24.1808 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000009 ns

STPCE1EEBI

STMicroelectronics

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

2.7 V

32

32

2.5,3.3

GRID ARRAY

BGA388,26X26,50

2.45 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

YES

32

14.318 MHz

35 mm

CMOS

2.5 V

Microprocessors

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

100 rpm

e0

16

PSD512B1-90JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

CHIP CARRIER

4.5 V

85 Cel

-40 Cel

QUAD

4.57 mm

1024

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

30 MHz

24.1808 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

40

ZPSD512B0-90UI

STMicroelectronics

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

FLATPACK, LOW PROFILE

4.5 V

85 Cel

-40 Cel

QUAD

1.6 mm

14 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

30 MHz

14 mm

CMOS

5 V

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

.65 mm

S-PQFP-G80

Not Qualified

40

PSD503B1-70U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

512

14 mm

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

50 MHz

14 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000007 ns

STPCC0166BTI3

STMicroelectronics

MULTIFUNCTION PERIPHERAL

INDUSTRIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

32

32

3.3

GRID ARRAY

BGA388,26X26,50

3 V

85 Cel

-40 Cel

TIN LEAD

BOTTOM

2.38 mm

35 mm

NO

32

14.318 MHz

35 mm

CMOS

3.3 V

Microprocessors

PCI; ISA

1.27 mm

S-PBGA-B388

Not Qualified

66 rpm

e0

ZPSD511B1-70L

STMicroelectronics

COMMERCIAL

J BEND

68

WQCCJ

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

5.5 V

16

CHIP CARRIER, WINDOW

4.5 V

70 Cel

0 Cel

QUAD

4.57 mm

1024

24.105 mm

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

24.105 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-CQCC-J68

Not Qualified

40

PSD512B1-70U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

1024

14 mm

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

50 MHz

14 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000007 ns

STID337

STMicroelectronics

NOT SPECIFIED

NOT SPECIFIED

STV0910BDBT

STMicroelectronics

NOT SPECIFIED

NOT SPECIFIED

PSD501B1-70JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

CHIP CARRIER

4.5 V

85 Cel

-40 Cel

QUAD

4.57 mm

512

24.1808 mm

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

36 MHz

24.1808 mm

CMOS

5 V

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

40

ZPSD512B1-15JI

STMicroelectronics

INDUSTRIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

CHIP CARRIER

LDCC68,1.0SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

4.57 mm

1024

24.18 mm

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

24.18 mm

512 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

1.27 mm

S-PQCC-J68

Not Qualified

e0

.00002 Amp

40

.00000015 ns

ZPSD511B1-15U

STMicroelectronics

COMMERCIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

70 Cel

0 Cel

TIN LEAD

N

QUAD

1.6 mm

1024

14 mm

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

8

34.48 MHz

14 mm

256 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000015 ns

PSD503B1-15UI

STMicroelectronics

INDUSTRIAL

GULL WING

80

LQFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

16

5

FLATPACK, LOW PROFILE

QFP80,.64SQ

4.5 V

85 Cel

-40 Cel

TIN LEAD

N

QUAD

1.6 mm

512

14 mm

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

NO

16

34.48 MHz

14 mm

1024 Bits

CMOS

5 V

Other Microprocessor ICs

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

.65 mm

S-PQFP-G80

Not Qualified

e0

.00002 Amp

40

.00000015 ns

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.