Texas Instruments - M38510/31901BEX

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Words Code: 1M;

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

Other Memory ICs;

ST25DV04K-JFR6D3 by STMicroelectronics is a 4Kx1 memory circuit with 4096-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C and comes in a small outline package for industrial applications. With synchronous operation and no-lead terminals, it is suitable for various IoT and RFID systems.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: LBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Organization: 1KX11;

CRYPTO MEMORY; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; No. of Words Code: 128K; Terminal Position: UPPER;

MEMORY CIRCUIT;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 1;

CRYPTO MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;

MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; JESD-30 Code: R-XQCC-N32;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: ZIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;

MR25H10CDFR by Everspin Technologies is a 128KX8 MEMORY CIRCUIT IC with 1048576 bit Memory Density. It operates at 3V, has a small outline package style, and can withstand industrial temperatures. Ideal for applications requiring fast synchronous memory access in compact electronic devices.