Texas Instruments - TMS27L08JL

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Technology: CMOS;

MEMORY CIRCUIT;

Other Memory ICs;

CY15B102Q-SXE by Infineon Technologies is a 256KX8 MEMORY CIRCUIT with SYNCHRONOUS operation and 3.3V nominal voltage. Ideal for AUTOMOTIVE applications, it features a small outline package style, operates in temperatures ranging from -40 to 125 °C, and has a memory density of 2097152 bit.

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; Technology: CMOS; Memory Density: 4096 bit;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Package Body Material: METAL; No. of Functions: 1;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; No. of Words Code: 4K; Technology: CMOS;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Organization: 16MX16;

MR25H256CDC by Everspin Tech is a 32Kx8 memory IC with CMOS tech. Operating at 3V, it has a temp range of -40 to 85°C. With synchronous mode and 262144-bit density, it suits industrial applications needing reliable non-volatile memory solutions.

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA88,8X12,32;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: VLGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;

MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; Memory Density: 8388608 bit;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: VLGA; Package Shape: RECTANGULAR; No. of Functions: 1;