Texas Instruments - TMS27C291-45FN

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 168; Package Code: DIMM; Refresh Cycles: 4096; Package Shape: RECTANGULAR;

MR25H10CDF by Everspin Technologies is a synchronous memory IC with a capacity of 128Kx8 and a memory density of 1,048,576 bits. It operates at a nominal voltage of 3V and has a max operating temperature of 85°C. This memory circuit is commonly used in industrial applications requiring reliable and high-performance data storage.

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00011 Amp;

MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; Terminal Form: UNSPECIFIED; No. of Functions: 1;

Other Memory ICs;

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOJ; Package Shape: RECTANGULAR; Memory Width: 4;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Technology: CMOS;

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP24,.6;

CRYPTO MEMORY; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; No. of Functions: 1;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

Other Memory ICs;

MR0A08BYS35R by Everspin Technologies is a 128KX8 memory circuit with a CMOS technology. It operates asynchronously at a nominal voltage of 3.3V and has a max access time of 35ns. This memory IC is commonly used in applications that require high-speed data storage and retrieval.

MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Operating Mode: ASYNCHRONOUS;