Everspin Technologies - MR25H256ACDF

MR25H256ACDF by Everspin Technologies

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Manufacturer Everspin Technologies
Manufacturer's Part Number MR25H256ACDF
Description SPI BUS SERIAL EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
Datasheet MR25H256ACDF Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32KX8
Maximum Seated Height: .9 mm
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 8
No. of Words: 32768 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PDSO-N8
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: HVSON
Width: 5 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 262144 bit
Memory IC Type: SPI BUS SERIAL EEPROM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Length: 6 mm
No. of Words Code: 32K
Nominal Supply Voltage / Vsup (V): 3
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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