Enhanced Memory Systems - FM24C04A-S

VIDEO DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 31; Terminal Pitch: 2.54 mm; Package Equivalence Code: SIP31,.2; Maximum Access Time: 200 ns;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 64 words;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .01 Amp;

ST25DV04K-IER6T3 by STMicroelectronics is a 4Kx1 memory IC with 4096-bit memory density. It operates synchronously at 3.3V, suitable for industrial applications. The small outline package has a rectangular shape, 0.65mm terminal pitch, and dual terminal position for surface mount assembly.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Shape: SQUARE; Memory Density: 8388608 bit; Technology: CMOS;

Other Memory ICs;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Organization: 1MX16;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP8,.25;

MR0A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit memory density. Operating at 3.3V, it has an access time of 35ns and supports asynchronous mode. This PLASTIC/EPOXY IC in SMALL OUTLINE package is ideal for various commercial applications requiring high-speed memory functions.

MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MEMORY CIRCUIT; No. of Terminals: 2; Package Shape: ROUND; JESD-609 Code: e0; No. of Words Code: 64; Memory Width: 1;

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 512MX16; No. of Words Code: 512M;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; Minimum Operating Temperature: -55 Cel;