Texas Instruments - SN54LS189AJ

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;

CRYPTO MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-X8;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

Other Memory ICs;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Operating Mode: ASYNCHRONOUS;

ST25DV64K-JFR6D3 by STMicroelectronics is a 64Kx1 memory IC with CMOS technology. It operates synchronously at 3.3V, suitable for industrial applications. With a small outline package and dual terminals, it offers a memory density of 65536 bits for various electronic devices.

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; No. of Functions: 1; Technology: CMOS; Maximum Supply Voltage (Vsup): 5.5 V;

DS1996L-F5+ by Analog Devices is an 8KX8 MEMORY CIRCUIT with 65536 bit Memory Density. It operates in ASYNCHRONOUS mode at -40 to 70 °C, with Power Supplies of 3/5 V. This METAL package IC is ideal for applications requiring reliable non-volatile memory storage in a compact ROUND DISK BUTTON form factor.

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; No. of Words Code: 256; No. of Words: 256 words;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Organization: 5X12; Qualification: Not Qualified; No. of Words Code: 5; JESD-609 Code: e0; Operating Mode: SYNCHRONOUS;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: VLGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;

47L16-E/SN by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is suitable for automotive applications due to its CMOS technology, -40 to 125 °C temperature range, and compact rectangular package shape.

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 100 ns;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Terminal Position: DUAL;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00002 Amp;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;