Texas Instruments - TMS27C291-35N

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: VLGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Technology: MOS;

MR0A08BYS35R by Everspin Technologies is a 128KX8 memory circuit with a CMOS technology. It operates asynchronously at a nominal voltage of 3.3V and has a max access time of 35ns. This memory IC is commonly used in applications that require high-speed data storage and retrieval.

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Surface Mount: NO; JESD-609 Code: e0; JESD-30 Code: R-XSSS-X;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 2MX16;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Technology: MOS;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 135 mA;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;