Texas Instruments - SNC54AS870JT

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; No. of Words Code: 160G; Memory Density: 1374389534720 bit; Technology: CMOS;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOJ; Package Shape: RECTANGULAR; Memory Width: 4;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

Other Memory ICs;

ST25DV16K-IER6T3 by STMicroelectronics is a 16KX1 MEMORY CIRCUIT with 16384 bit Memory Density. It operates at 3.3V, -40 to 85 °C temperature range, in SYNCHRONOUS mode. Ideal for industrial applications requiring small outline, thin profile ICs with shrink pitch package style.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Terminal Form: C BEND;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; No. of Words: 1048576 words;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Memory Density: 64 bit;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;

MR25H10MDF by Everspin Technologies is a 128Kx8 memory IC with CMOS technology. It operates synchronously at a nominal voltage of 3V, suitable for automotive applications. With a small outline package style and very thin profile, it offers high memory density of 1048576 bits for various electronic devices.

MEMORY CIRCUIT;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 1;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5; No. of Words Code: 128; Terminal Position: SINGLE;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.28 mm;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;