Texas Instruments - TMS27PC32-12NE

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; JESD-30 Code: O-MRDB-N2; Operating Mode: ASYNCHRONOUS;

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MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Maximum Access Time: 22 ns;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; Qualification: Not Qualified; Technology: CMOS;

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MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;

MR45V032AMAZBATL by Lapis Semiconductor is a small outline, low profile memory IC with a capacity of 4096 words and a memory density of 32768 bits. It operates synchronously at a nominal voltage of 3.3V and can withstand temperatures ranging from -40 to 85°C. This memory circuit is commonly used in industrial applications requiring compact and reliable storage solutions.

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

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MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 33554432 bit;

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47L16-E/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for automotive applications due to its thin profile, wide temperature range (-40 to 125°C), and high memory density of 16384 bits.

MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-609 Code: e3; JESD-30 Code: X-XXSS-X; Terminal Form: UNSPECIFIED; Technology: CMOS;

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;

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Other Memory ICs;