Texas Instruments - SN54HC670J

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;

Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B153;

MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MR25H256ACDF by Everspin Technologies is a 32KX8 SPI BUS SERIAL EEPROM memory IC with a memory density of 262144 bits. It operates at a nominal voltage of 3V and has an industrial temperature grade. This memory IC is suitable for applications requiring small outline, heat sink, and very thin profile packages.

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; No. of Functions: 1; Package Equivalence Code: MODULE,5LEAD,.65;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Shape: ROUND; Package Style (Meter): CYLINDRICAL; Nominal Supply Voltage / Vsup (V): 5;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; No. of Functions: 1; Nominal Supply Voltage / Vsup (V): 5; Surface Mount: NO;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; No. of Words: 1048576 words;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00002 Amp;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Finish: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5);

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1024 words;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: VLGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: ZIP; Package Shape: RECTANGULAR; Terminal Position: ZIG-ZAG;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; JESD-30 Code: R-XSSS-X; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOJ; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;