Micron Technology - MTFC16GLTAM-WT

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MTFC16GLTAM-WT by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number MTFC16GLTAM-WT
Description Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B153;
Datasheet MTFC16GLTAM-WT Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Memory Density: 137438953472 bit
Sub-Category: Other Memory ICs
Surface Mount: YES
Minimum Operating Temperature: -25 Cel
No. of Terminals: 153
Qualification: Not Qualified
Package Equivalence Code: BGA153,14X14,20
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
JESD-30 Code: S-PBGA-B153
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Power Supplies (V): 1.8/3.3,3/3.3
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