Renesas Electronics - DA16200MOD-AAE4WA32

XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.

XCZU5CG-L2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY package style. Suitable for applications requiring low supply voltage of 0.72 V and high peak reflow temperature of 250°C, making it ideal for advanced electronic systems.

XCZU7EV-2FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high performance and reliability in compact designs.

XCZU4EV-2FBVB900E by Xilinx is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.

MCIMX535DVV1C by NXP Semiconductors is a System on Chip with 529 terminals, operating at -20 to 85°C. It has a supply voltage range of 0.9/1.25-1.3V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact form factors.

NT3H2111W0FHK by NXP Semiconductors is a surface mount microprocessor circuit with 8 terminals. It operates at a supply voltage range of 1.67V to 3.6V and can withstand temperatures from -40°C to 105°C. This chip carrier package is commonly used in industrial applications requiring NFC functionality.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE; Package Equivalence Code: TQFP128,.63SQ,16;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

PSoC; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e4;

SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 1.79 mm;

CC1310F128RSMR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.8 V and comes in a square chip carrier package style for industrial applications requiring microprocessor circuits.

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Other uPs/uCs/Peripheral ICs;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

FTDI's FT245RL-REEL is a 28-terminal peripheral IC with CMOS technology. It operates b/w -40 to 85°C, suitable for industrial applications. With a supply voltage range of 3.3V to 5.25V, it is ideal for microprocessor circuits requiring small outline packages and dual terminal positions.

The NXP Semiconductors MIMX8MM1DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. It operates b/w 0-95°C, with supply voltage ranging from 0.95-1.05V. Ideal for applications requiring high performance in compact spaces.

XCZU2CG-1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-PQCC-N32;