Ember - EM357-RTR

FTDI's FT800Q-R is a 48-terminal chip carrier IC with CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications. With a supply voltage range of 2.97-3.63 V, it is ideal for microprocessor circuits requiring a compact form factor and low power consumption.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 112; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.

SoC;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA225,15X15,32;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

SoC FPGA;

ESP32-S3-WROOM-1-N16R8 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V nominal voltage and up to 65°C. Its compact MICROELECTRONIC ASSEMBLY package makes it suitable for IoT devices requiring low power consumption and high performance in a small form factor. With a max supply voltage of 3.6V, it is ideal for applications where space constraints are critical.

CC1310F128RHBT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring a microprocessor circuit in a compact chip carrier package.

MICROPROCESSOR CIRCUIT; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;

P82B715DG4 by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 12V, operating b/w -40°C to 85°C. It features I2C bus compatibility, clock frequency up to 0.4MHz, and is ideal for industrial applications requiring microprocessor circuits in a small outline package.

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

SoC;

MIMX8MM6DVTLZAA by NXP Semiconductors is a low-profile, fine-pitch SoC with 486 terminals. It operates at a voltage range of 0.95V to 1.05V and can withstand temperatures up to 95°C. This versatile chip is commonly used in various applications requiring high-performance microcontrollers and peripheral ICs.

Other uPs/uCs/Peripheral ICs;