NXP Semiconductors - P1015NSN5DFB

P1015NSN5DFB by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number P1015NSN5DFB
Description SoC; Terminal Form: BALL; No. of Terminals: 561; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 1.79 mm;
Datasheet P1015NSN5DFB Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Nominal Supply Voltage: 1 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Supply Voltage: 1.05 V
Maximum Seated Height: 1.79 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 561
Package Equivalence Code: BGA561,27X27,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 23 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B561
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 260
Package Code: FBGA
Width: 23 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 3
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