Infineon Technologies - CY8C20110-SX2IT

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G20;

Other Memory ICs; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Terminal Finish: TIN LEAD; Nominal Supply Voltage / Vsup (V): 5; Maximum Operating Temperature: 85 Cel;

MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; JESD-609 Code: e4;

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Other Memory ICs;

Other Memory ICs;

MR25H256ACDF by Everspin Technologies is a 32KX8 SPI BUS SERIAL EEPROM memory IC with a memory density of 262144 bits. It operates at a nominal voltage of 3V and has an industrial temperature grade. This memory IC is suitable for applications requiring small outline, heat sink, and very thin profile packages.

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 450 ns;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512;

Other Memory ICs;

Other Memory ICs;

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP24,.6;

Other Memory ICs; Peak Reflow Temperature (C): NOT SPECIFIED; Qualification: Not Qualified; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

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Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.28 mm;

Other Memory ICs;

MEMORY CIRCUIT;

Other Memory ICs;