![MCIMX6Q5EYM12AC by Freescale Semiconductor MCIMX6Q5EYM12AC by Freescale Semiconductor](https://partstack.com/mpn/images/200/1827620969.webp)
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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | MCIMX6Q5EYM12AC |
Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
Datasheet | MCIMX6Q5EYM12AC Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | SYSTEM ON CHIP |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.6 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -20 Cel |
No. of Terminals: | 624 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Length: | 21 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B624 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | LFBGA |
Width: | 21 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 3 |