M/a-com Technology Solutions - M82820G-15

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

MCIMX6Y2CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105 °C and has a supply voltage range of 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

ATSHA204A-SSHDA-B by Microchip Technology is a small outline cryptographic authenticator with 8 terminals. It operates at a voltage range of 2V to 5.5V and has a temperature range of -40°C to 85°C. This IC is commonly used for secure authentication purposes.

Other uPs/uCs/Peripheral ICs; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

MCIMX351AJQ5C by NXP Semiconductors is a multifunction peripheral IC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.33V to 1.47V. This low-profile, fine-pitch grid array package is ideal for industrial applications requiring high performance in compact spaces.

NETWORK CONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; Terminal Pitch: 1.016 mm;

Other uPs/uCs/Peripheral ICs;

ATMXT224S-MAUR043 by Microchip Technology is a 56-terminal, surface mount IC with a square package shape. It operates at a voltage range of 3V to 3.47V and has a max seated height of 0.6mm. This capacitive touch screen controller is suitable for various applications requiring precise touch input.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;

XCZU5CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a nominal voltage of 0.85 V. This device, featuring a GRID ARRAY package style, is suitable for various applications requiring high-performance processing capabilities.

CY8C3866AXI-039T by Infineon is a 100-terminal, low-profile, fine-pitch FLATPACK IC with a CMOS technology and 524288 ROM bits. Operating at -40 to 85 °C, it has a supply voltage range of 1.71V to 5.5V making it ideal for industrial applications requiring a programmable SoC solution.

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, SHRINK PITCH;

SLM9670AQ20FW1311XTMA1 by Infineon is a 32-terminal IC with max supply voltage of 1.95V and min operating temp of -40°C. Ideal for cryptographic authentication applications due to its CMOS technology, quad terminal position, and compact square package style.

XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 441; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B441;