Assmann Wsw Components - V7236A1

TE Connectivity's 1963856-1 is a HEAT SINK with dimensions of 111.5x85.6x10.27mm, made of ALUMINUM ALLOY with ANODIZED finish. Its FIN construction and LONGITUDINAL orientation make it ideal for thermal management in various electronic applications.

Boyd's 574602B03300G heat sink has a thermal resistance of 21.6 ohm, U profile, and aluminum body material. Ideal for applications requiring efficient heat dissipation in compact spaces like electronic devices or LED lighting systems.

HEAT SINK; Body Material: COPPER; Device Used On: IC; Weight: 2 g; Width: 8 mm; Packing Method: TAPE AND REEL;

Heat Sinks;

HEAT SINK;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: IC; Fin Orientation: RADIAL; Power (Rated): 15 W;

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 59 mm; Height: 22.9 mm;

HEAT SINK;

HEAT SINK;

HEAT SINK; Body Material: COPPER; Width: 14.99 mm; Height: 9.52 mm; Thermal Resistance: 15 ohm; Length: 25.91 mm;

Heat Sinks;

658-35AB-T4 by Wakefield-vette is a PIN FIN ARRAY heat sink with a height of 8.89 mm, width and length of 30.73 mm. It is made of black anodized aluminum and has an omnidirectional fin orientation. This heat sink is commonly used in electronic devices for efficient thermal management.

HEAT SINK;

ICKBGA10X10 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It is designed for IC devices, measuring 10mm in width and length. Ideal for cooling electronic components efficiently in various applications.

HEAT SINK;

Heat Sinks;

HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Height: 25 mm; Color: BLACK; Thermal Resistance: 7.4 ohm;

Heat Sinks;

HEAT SINK; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 19.4 mm; Thermal Resistance: 7.8 ohm;

HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;