Boyd - 574602B03300G

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Construction: FLARED; Fin Orientation: RADIAL; Color: BLACK; Length: 34.9 mm;

Heat Sinks;

Heat Sinks;

HEAT SINK;

HEAT SINK;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Length: 19.1 mm; Color: BLACK; Finish: ANODIZED; Width: 13.2 mm;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Length: 34.5 mm;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: IC; Fin Orientation: RADIAL; Approvals (V): UL;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM ALLOY; Device Used On: TRANSISTOR; Fin Orientation: LONGITUDINAL; Width: 12.7 mm; Length: 35 mm;

573100D00010G by Boyd is a U-profile heat sink with dimensions of 22.86mm x 8mm x 10.16mm (LxWxH). It has a thermal resistance of 15 ohm and is made of copper, making it suitable for applications requiring efficient heat dissipation.

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: IC; Fin Orientation: RADIAL; Power (Rated): 15 W;

HEAT SINK; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Width: 19.4 mm; Thermal Resistance: 7.8 ohm;

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: OMNIDIRECT; Length: 53 mm; Finish: ANODIZED;

HEAT SINK; Construction: EXTRUDED; Height: 31.8 mm; Length: 38.1 mm; Weight: 68.04 g; Width: 120.7 mm;

Ohmite's WA-T247-101E heat sink has thermal resistance of 11Ω, height 30.5mm, and length 23.1mm. Ideal for transistors, this extruded aluminum alloy clip-on heat sink with longitudinal fin orientation is anodized black and weighs 12g.

658-35AB-T4 by Wakefield-vette is a PIN FIN ARRAY heat sink with a height of 8.89 mm, width and length of 30.73 mm. It is made of black anodized aluminum and has an omnidirectional fin orientation. This heat sink is commonly used in electronic devices for efficient thermal management.

Boyd 322400B00000G Heat Sink has Thermal Resistance of 99.99Ω, Height of 5.97mm, and Radial Fin Orientation. Ideal for cooling electronic components in compact devices like laptops and LED displays due to its efficient heat dissipation capabilities.