Analog Devices - DS2401+T&R

  1. Home
  2. Analog Devices - DS2401+T&R
DS2401+T&R by Analog Devices

Image shown is a representation only.

Manufacturer Analog Devices
Manufacturer's Part Number DS2401+T&R
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Terminal Finish: Matte Tin (Sn) - annealed;
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64X1
Minimum Supply Voltage (Vsup): 2.8 V
Sub-Category: Other Memory ICs
Surface Mount: NO
Terminal Finish: Matte Tin (Sn) - annealed
No. of Terminals: 3
No. of Words: 64 words
Terminal Position: BOTTOM
Package Style (Meter): CYLINDRICAL
Technology: CMOS
JESD-30 Code: O-PBCY-T3
Package Shape: ROUND
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TO-92
Memory Density: 64 bit
Memory IC Type: MEMORY CIRCUIT
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
No. of Words Code: 64
Nominal Supply Voltage / Vsup (V): 5
Peak Reflow Temperature (C): 250
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 6 V
Power Supplies (V): 3/5
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MB85RS256BPNF-G-JNE1 by Fujitsu

MB85RS256BPNF-G-JNE1

Fujitsu

Fujitsu's MB85RS256BPNF-G-JNE1 is a 262Kb memory IC with 32Kx8 organization, operating at 3.3V. It features synchronous operation, industrial temperature grade, and small outline package suitable for various applications requiring reliable non-volatile memory storage.
SNJ54AS870FH by Texas Instruments

SNJ54AS870FH

Texas Instruments

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;
MB85RS4MTYPF-G-BCERE1 by Fujitsu

MB85RS4MTYPF-G-BCERE1

Fujitsu

Other Memory ICs;
TMS2716JL by Texas Instruments

TMS2716JL

Texas Instruments

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 16384 bit;
MT38W2021A902ZQXZI.X69 by Micron Technology

MT38W2021A902ZQXZI.X69

Micron Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
SNC54AS870JT by Texas Instruments

SNC54AS870JT

Texas Instruments

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;
47L16T-E/SN by Microchip Technology

47L16T-E/SN

Microchip Technology

47L16T-E/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 2KX8 organization. Operating at -40 to 125 °C, it has a memory density of 16384 bit and max access time of 400 ns. Ideal for automotive applications due to its small outline package style and CMOS technology.
SN54AS871FH by Texas Instruments

SN54AS871FH

Texas Instruments

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE; Terminal Position: QUAD;
MR0A16ACYS35 by Freescale Semiconductor

MR0A16ACYS35

Freescale Semiconductor

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36W216B85ZA1 by STMicroelectronics

M36W216B85ZA1

STMicroelectronics

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;
M36W108B100ZM6T by STMicroelectronics

M36W108B100ZM6T

STMicroelectronics

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
M36W0R6040B0ZAQF by STMicroelectronics

M36W0R6040B0ZAQF

STMicroelectronics

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
27C64 by Thomson-csf Compsants Specific

27C64

Thomson-csf Compsants Specific

Other Memory ICs;
DS1207-G05 by Analog Devices

DS1207-G05

Analog Devices

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; No. of Functions: 1; Package Equivalence Code: MODULE,5LEAD,.65;
CY8C20110-LDX2I by Cypress Semiconductor

CY8C20110-LDX2I

Cypress Semiconductor

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: VQCCN; Package Shape: SQUARE; No. of Words Code: 2K;
DS1207-G5C by Analog Devices

DS1207-G5C

Analog Devices

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel; Qualification: Not Qualified; Package Body Material: UNSPECIFIED;
DS1207 by Analog Devices

DS1207

Analog Devices

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Maximum Operating Temperature: 70 Cel; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Qualification: Not Qualified;
47L16T-I/SN by Microchip Technology

47L16T-I/SN

Microchip Technology

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
M36W108T100ZM5 by STMicroelectronics

M36W108T100ZM5

STMicroelectronics

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
DS1207-G02 by Analog Devices

DS1207-G02

Analog Devices

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; Terminal Form: UNSPECIFIED; Technology: CMOS;