Micron Technology - MT38W2021A902ZQXZI.X69

MT38W2021A902ZQXZI.X69 by Micron Technology

Image shown is a representation only.

Manufacturer Micron Technology
Manufacturer's Part Number MT38W2021A902ZQXZI.X69
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;
Datasheet MT38W2021A902ZQXZI.X69 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4MX16
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 88
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B88
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 8 mm
Memory Density: 67108864 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Length: 10 mm
No. of Words Code: 4M
Additional Features: IT ALSO CONTAINS 32MBIT(2MBIT X 16) PSRAM
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products