Texas Instruments - TMS27PC49-45JL

DS2411R/T&R by Maxim Integrated is a 64-bit MEMORY CIRCUIT with 64x1 organization. Operating in ASYNCHRONOUS mode, it has a supply voltage range of 1.5V to 5.25V and operates in industrial temperature grade applications. This PLASTIC/EPOXY IC is surface mountable, featuring a small outline package style with dual GULL WING terminals for compact designs.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Words Code: 512;

MR45V032AMAZBATL by Lapis Semiconductor is a small outline, low profile memory IC with a capacity of 4096 words and a memory density of 32768 bits. It operates synchronously at a nominal voltage of 3.3V and can withstand temperatures ranging from -40 to 85°C. This memory circuit is commonly used in industrial applications requiring compact and reliable storage solutions.

MR2A16ACYS35 by Freescale Semiconductor is a 256Kx16 memory IC with 3.3V supply, operating in industrial temperature range of -40 to 85°C. It features asynchronous mode, 35ns access time, and GULL WING terminals. Ideal for applications requiring high-speed memory operations in compact electronic devices.

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T24;

Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B153;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-N8;

MR44V064BMAZAATL by Lapis Semiconductor is a synchronous memory IC with 8Kx8 organization and 65536-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C, making it suitable for industrial applications requiring small outline, low profile packages in a rectangular shape.

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 33554432 bit;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;

MEMORY CIRCUIT;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: ZIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;

Other Memory ICs;