STMicroelectronics - ST25DV16K-IER6T3

ST25DV16K-IER6T3 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number ST25DV16K-IER6T3
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet ST25DV16K-IER6T3 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16KX1
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.8 V
Surface Mount: YES
No. of Terminals: 8
No. of Words: 16384 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G8
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TSSOP
Width: 3 mm
Memory Density: 16384 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Length: 4.4 mm
No. of Words Code: 16K
Nominal Supply Voltage / Vsup (V): 3.3
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 5.5 V
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