Texas Instruments - SN74ALS870DWP3

MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e3;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1024 words;

CRYPTO MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: XMA; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-X8;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: ZIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;

MR25H256CDC by Everspin Tech is a 32Kx8 memory IC with CMOS tech. Operating at 3V, it has a temp range of -40 to 85°C. With synchronous mode and 262144-bit density, it suits industrial applications needing reliable non-volatile memory solutions.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 6 V;

Analog Devices' DS2401P+T&R is a 64-bit MEMORY CIRCUIT with 6 terminals, operating at 5V. It features ASYNCHRONOUS mode, CMOS technology, and industrial temperature grade. The IC is used in applications requiring small outline packages for memory storage in devices like sensors or IoT modules.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;

Other Memory ICs;

DS2401Z+T&R by Analog Devices is a 64X1 memory circuit with a memory density of 64 bits. It operates asynchronously at a nominal voltage of 5V and has a small outline package style. This IC is commonly used in industrial applications requiring low power consumption and compact size.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

MR2A16ACYS35 by Freescale Semiconductor is a 256Kx16 memory IC with 3.3V supply, operating in industrial temperature range of -40 to 85°C. It features asynchronous mode, 35ns access time, and GULL WING terminals. Ideal for applications requiring high-speed memory operations in compact electronic devices.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; Memory Density: 8388608 bit;

MEMORY CIRCUIT; Organization: 5X12; Qualification: Not Qualified; No. of Words Code: 5; JESD-609 Code: e0; Operating Mode: SYNCHRONOUS;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;