Dallas Semiconductor - DS2401Z/T&R

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Other Memory ICs; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified; Technology: ECL; Minimum Operating Temperature: 0 Cel;

Other Memory ICs;

DS2411R/TR by Dallas Semiconductor is a 3-terminal memory IC with plastic/epoxy package. It operates in industrial temperature range (-40 to 85°C) and requires 2/5V power supply. Ideal for applications requiring low standby current (0.000001A) and minimal supply current (0.1mA).

MEMORY CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 32KX8;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 64 words;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Package Shape: RECTANGULAR; Terminal Form: UNSPECIFIED; No. of Words Code: 256;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

CRYPTO MEMORY; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; No. of Functions: 1;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Technology: CMOS; Minimum Supply Voltage (Vsup): 4.5 V;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B153;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Form: GULL WING;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;