Texas Instruments - SMJ27C010-25J

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOJ; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;

Other Memory ICs; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T16;

Other Memory ICs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE; Screening Level: MIL-STD-883 Class B (Modified);

MEMORY CIRCUIT; No. of Terminals: 44; Package Shape: UNSPECIFIED; No. of Functions: 1; Maximum Supply Voltage (Vsup): 5.5 V; Nominal Supply Voltage / Vsup (V): 5;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Maximum Access Time: 22 ns;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Package Body Material: METAL; No. of Functions: 1;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; Terminal Finish: TIN LEAD; Minimum Operating Temperature: 0 Cel; Qualification: Not Qualified;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G24;

Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;

M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.

CRYPTO MEMORY; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; No. of Functions: 1;

MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;

MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

Other Memory ICs;