Maxim Integrated - DS2401AP+

MEMORY CIRCUIT; No. of Terminals: 149; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Memory Density: 8589934592 bit;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 107; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: PSRAM IS ORGANISED AS 8M X 16BIT;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 5; Qualification: Not Qualified; Maximum Supply Current: 6 mA; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Additional Features: ALSO CONTAINS 128K X 16 SRAM;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Width: 9.8 mm;

DS2411R/TR by Dallas Semiconductor is a 3-terminal memory IC with plastic/epoxy package. It operates in industrial temperature range (-40 to 85°C) and requires 2/5V power supply. Ideal for applications requiring low standby current (0.000001A) and minimal supply current (0.1mA).

MR2A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit Memory Density. Operating at 3.3V, it has an Access Time of 35ns and supports ASYNCHRONOUS mode. This PLASTIC/EPOXY IC in SMALL OUTLINE, THIN PROFILE package is ideal for applications requiring high-speed memory access in commercial temperature environments.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Terminal Form: C BEND;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;

Intel 7230 is a CMOS memory circuit with 22 terminals in an in-line rectangular package. It has a max seated height of 5.08mm, width of 10.16mm, and length of 27.3685mm. Ideal for applications requiring compact memory ICs with through-hole terminals.

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 16;

MEMORY CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed;

Other Memory ICs;

Other Memory ICs; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: 0 Cel; Technology: TTL; Qualification: Not Qualified;