Texas Instruments - DM76S64BWF/J883B

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

MEMORY CIRCUIT;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5; No. of Words Code: 128; Terminal Position: SINGLE;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; Package Shape: UNSPECIFIED; No. of Functions: 1; Nominal Supply Voltage / Vsup (V): 5; Surface Mount: NO;

MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.7 V;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G20;

MR44V064BMAZAATL by Lapis Semiconductor is a synchronous memory IC with 8Kx8 organization and 65536-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C, making it suitable for industrial applications requiring small outline, low profile packages in a rectangular shape.

MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 64 words;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;

Other Memory ICs;

Other Memory ICs;

MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP20,.3;

MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;

Other Memory ICs;

MEMORY CIRCUIT;

Other Memory ICs;

Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;