BALF-NRG-02D3 by STMicroelectronics | Vyrian | Semiconductor & Electronic Component Distributor

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	BALF-NRG-02D3
Description	RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 4; Package Code: VBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet	BALF-NRG-02D3 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Telecom IC Type:	RF AND BASEBAND CIRCUIT
Maximum Seated Height:	.69 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	4
Package Equivalence Code:	BGA4,2X2,40/16
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length:	1.385 mm
JESD-30 Code:	R-PBGA-B4
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Peak Reflow Temperature (C):	260
Package Code:	VBGA
Width:	.855 mm
Terminal Pitch:	1 mm

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