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| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | AD9986BBPZRL-4D2AC |
| Description | RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 324; Package Code: HFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
| Datasheet | AD9986BBPZRL-4D2AC Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | 1.72 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 4070 mA |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 324 |
| Package Equivalence Code: | BGA324,18X18,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| Length: | 15 mm |
| JESD-30 Code: | S-PBGA-B324 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 120 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HFBGA |
| Width: | 15 mm |
| Terminal Pitch: | .8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
